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  55659-1619 Datasheet PDF File

For 55659-1619 Found Datasheets File :: 145+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    PHILIPS[Philips Semiconductors]
Part No. NE1619DS NE1619
Description Temperature and voltage monitor
File Size 167.28K  /  19 Page

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Amphenol Communications Solutions
Part No. U77C16192001
Description ExpressPort SFP+, High Speed Input Output Connectors, 1X1 SFPP CAGE W/ LP.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





   
Part No. AP161902
Description From old datasheet system
File Size 79.90K  /  7 Page

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Amphenol Communications Solutions
Part No. 54122-811161900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

   
Part No. CXA1619S
Description From old datasheet system
File Size 398.39K  /  12 Page

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Amphenol Communications Solutions
Part No. 10154416-192SLF
Description M-SERIES 56, 1 MM Plug, 4-Pair, 20-Column, 260-PIN, 30u\\. Plating
Tech specs 　 　

Official Product Page

    PANASONIC[Panasonic Semiconductor]
Part No. 2SA1619A 2SA1619
Description Silicon PNP epitaxial planer type
File Size 46.17K  /  3 Page

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Amphenol Communications Solutions
Part No. U77A16193001
Description ExpressPort SFP+, High Speed Input Output Connectors, SFP 1X1 CAGE.
Tech specs 　 　

Official Product Page

    NE1619DS

NXP Semiconductors
Part No. NE1619DS
Description HECETA4 Temperature and voltage monitor
File Size 117.73K  /  19 Page

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Amphenol Communications Solutions
Part No. 54242-110161950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0556592019 55659-2019

Molex Electronics Ltd.
Part No. 0556592019 55659-2019
Description 1.25mm (.049) Pitch Mini Mi II?/a> Wire-to-Wire Adapter, Dual Row, 20 Circuits, Lead free
File Size 129.45K  /  2 Page

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Amphenol Communications Solutions
Part No. U77F16192001
Description ExpressPort SFP+, High Speed Input Output Connectors, SFP-P CG REAR PF PINS.
Tech specs 　 　

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    0556592039 55659-2039

Molex Electronics Ltd.
Part No. 0556592039 55659-2039
Description 1.25mm (.049) Pitch Mini Mi II?/a> Wire-to-Wire Adapter, Dual Row, without Panel Mount Clip, 20 Circuits, Lead-free
File Size 111.48K  /  2 Page

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Amphenol Communications Solutions
Part No. U77A1619200T
Description ExpressPort SFP+, High Speed Input Output Connectors, 1X1SFP PCI CAGE.
Tech specs 　 　

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    0556592219 55659-2219

Molex Electronics Ltd.
Part No. 0556592219 55659-2219
Description 1.25mm (.049) Pitch Mini Mi II?/a> Wire-to-Wire Adapter, Dual Row, 22 Circuits, Leadfree
File Size 129.45K  /  2 Page

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Amphenol Communications Solutions
Part No. U77A16192001
Description ExpressPort SFP+, High Speed Input Output Connectors, SFP 1X1 CAGE.
Tech specs 　 　

Official Product Page

    0556593439 55659-3439

Molex Electronics Ltd.
Part No. 0556593439 55659-3439
Description 1.25mm (.049) Pitch Mini Mi II?/a> Wire-to-Wire Adapter, Dual Row, without PanelMount Clip, 34 Circuits, Lead-free
File Size 111.48K  /  2 Page

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Amphenol Communications Solutions
Part No. 84516-192LF
Description 200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs 　 　

Official Product Page

    0556592239 55659-2239

Molex Electronics Ltd.
Part No. 0556592239 55659-2239
Description 1.25mm (.049) Pitch Mini Mi II?/a> Wire-to-Wire Adapter, Dual Row, without PanelMount Clip, 22 Circuits, Lead-free
File Size 111.48K  /  2 Page

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Amphenol Communications Solutions
Part No. 10161952-1210LF
Description Minitek®Pwr CEM-5 PCIe Receptacle Terminal (Signal), Tin Plating (Post plated), AWG(#28).
Tech specs 　 　

Official Product Page

For 55659-1619 Found Datasheets File :: 145+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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