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  52559-0672 Datasheet PDF File

For 52559-0672 Found Datasheets File :: 87+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |   

    0525592152

Molex Electronics Ltd.
Part No. 0525592152
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 21 Circuits, Lead-FreeGold Contact Plating, High Barrier Packaging

File Size 472.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 68020-672
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0525591653

Molex Electronics Ltd.
Part No. 0525591653
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 16 Circuits, Lead-freeGold (Au) Contact Plating

File Size 392.69K  /  7 Page

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Amphenol Communications Solutions

Part No. 76745-106-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0525591652

Molex Electronics Ltd.
Part No. 0525591652
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 16 Circuits, Lead-free Gold Contact Plating, High Barrier Packaging

File Size 471.62K  /  7 Page

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Amphenol Communications Solutions

Part No. 93690-106-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0525591552

Molex Electronics Ltd.
Part No. 0525591552
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 15 Circuits, Lead-FreeGold Contact Plating, High Barrier Packaging

File Size 471.61K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-106721000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0525591452

Molex Electronics Ltd.
Part No. 0525591452
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 14 Circuits, Lead-FreeGold Contact Plating, High Barrier Packaging

File Size 472.11K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-106721050LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0525593252 52559-3252

Molex Electronics Ltd.
Part No. 0525593252 52559-3252
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 32 Circuits, Lead-freeGold Contact Plating, High Barrier Packaging

File Size 471.62K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-106720850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0525591252

Molex Electronics Ltd.
Part No. 0525591252
Description 0.50mm (.020") Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 12 Circuits, Lead-free,Gold (Au) Plating, High Barrier Packaging

File Size 472.11K  /  8 Page

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Amphenol Communications Solutions

Part No. 68020-672H
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0525593652 52559-3652

Molex Electronics Ltd.
Part No. 0525593652 52559-3652
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 36 Circuits, Lead-free,Gold Contact Plating, High Barrier Packaging
Molex Electronics Ltd.

File Size 472.20K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-106720800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0525592752 52559-2752

Molex Electronics Ltd.
Part No. 0525592752 52559-2752
Description 0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 27 Circuits, Lead-freeGold Contact Plating, High Barrier Packaging
0.50mm (.020") Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 27 Circuits, Lead-freeGold Contact Plating, High Barrier Packaging

File Size 471.70K  /  7 Page

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Amphenol Communications Solutions

Part No. 54242-106720950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    52559-2652 0525592652

Molex Electronics Ltd.
Part No. 52559-2652 0525592652
Description 0.50mm (.020") Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 26 Circuits, Lead-free,Gold Contact Plating, High Barrier Packaging
0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 26 Circuits, Lead-free,Gold Contact Plating, High Barrier Packaging

File Size 472.11K  /  8 Page

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Texas Instruments

Part No. SN0806723IPNR
Description Single-phase Metering SoC with 2 Sigma-Delta ADCs, LCD, Real-Time Clock, 64KB Flash, 4KB RAM 80-LQFP -40 to 85
Tech specs    

Get Free Sample

Official Product Page

For 52559-0672 Found Datasheets File :: 87+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |   

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