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  52045-2045 Datasheet PDF File

For 52045-2045 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    11-40-2045 1140-2045 0011-40-2045

Molex Electronics Ltd.
Part No. 11-40-2045 1140-2045 0011-40-2045
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 19.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 9952-045
Description cStack™ Flexible Circuit Assemblies, Mezzanine Connectors, cStack Flex, 6 x 45 (270 position).
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71349-2045

Molex Electronics Ltd.
Part No. 71349-2045
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 26 Circuits, 0.38um

File Size 420.26K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021832-04510T1LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    87834-2045

Molex Electronics Ltd.
Part No. 87834-2045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 20 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-204506LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    Mindspeed Technologies
Part No. MC2045-2
Description Fiberoptic Postamplifier

File Size 136.44K  /  8 Page

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Amphenol Communications Solutions

Part No. 68020-458HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Mindspeed Technologies
Part No. MC2045-3
Description Postamplifier

File Size 346.87K  /  10 Page

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Amphenol Communications Solutions

Part No. 67292-045LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    OM2045

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. OM2045
Description Wideband Amplifier Module

File Size 314.24K  /  6 Page

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Amphenol Communications Solutions

Part No. 61083-204509LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    M2045S-E3_4W

Vishay Siliconix
Part No. M2045S-E3_4W
Description High-Voltage Trench MOS Barrier Schottky Rectifier

File Size 132.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-045
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    M2045S-E3/4W

Vishay Siliconix
Part No. M2045S-E3/4W
Description High-Voltage Trench MOS Barrier Schottky Rectifier

File Size 119.89K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-204502LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    Jiangsu Yutai Electroni...
Part No. SL2045
Description 20 0A Surface Mount Schottky Barrier Rectifiers

File Size 7,397.47K  /  2 Page

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Amphenol Communications Solutions

Part No. 68020-450HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ERNI Electronics
Part No. 204516
Description TMC-S-15-THR OM-Standard-BA8

File Size 112.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-204502LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

For 52045-2045 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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