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  50055-8103 Datasheet PDF File

For 50055-8103 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TPCF8103

Toshiba Semiconductor
Part No. TPCF8103
Description Notebook PC Applications

File Size 286.33K  /  7 Page

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Amphenol Communications Solutions

Part No. 73398-103ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, Duplex, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TPCA8103

Toshiba Semiconductor
Part No. TPCA8103
Description MOSFET TPC Series
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOS4)

File Size 250.85K  /  7 Page

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Amphenol Communications Solutions

Part No. 68418-103HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    ST081031

E-SWITCH
Part No. ST081031
Description ALL DIMENSIONS IN MM [INCH]

File Size 165.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 65781-036LF
Description Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,72 Positions
Tech specs    

Official Product Page

    NCP81039

ON Semiconductor
Part No. NCP81039
Description Mini Buck Converter for RF Power Amplifiers

File Size 181.96K  /  11 Page

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Amphenol Communications Solutions

Part No. 95278-103-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KDS181 KDS18103

KEC(Korea Electronics)
Part No. KDS181 KDS18103
Description SOT-23 PACKAGE

File Size 342.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-810301400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    ST081030

E-SWITCH
Part No. ST081030
Description ALL DIMENSIONS IN MM [INCH]

File Size 155.81K  /  1 Page

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Amphenol Communications Solutions

Part No. 10131868-103LF
Description OCTIS™ - Hybrid - Power & Signal, Board Connector for 10 pos. signal PiP
Tech specs    

Official Product Page

    TPCP8103-H

Toshiba Semiconductor
Part No. TPCP8103-H
Description Field Effect Transistor Silicon MOS Type

File Size 228.84K  /  4 Page

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Amphenol Communications Solutions

Part No. 10037908-103LF
Description Mechanical Guidance Modules, Backplane Connectors, 7.2mm Guide Blade-External Thread.
Tech specs    

Official Product Page

    PF08103B

HITACHI[Hitachi Semiconductor]
Part No. PF08103B
Description MOS FET Power Amplifier Module for E-GSM900 and DCS1800 Dual Band Handy Phone

File Size 33.47K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-810341000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

   
Part No. TPCP8103-H
Description 4800 mA, 40 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET

File Size 238.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 68488-103HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 4.57 mm (0.18 in.) Tail
Tech specs    

Official Product Page

    PF08103A

HITACHI[Hitachi Semiconductor]
Part No. PF08103A
Description MOS FET Power Amplifier Module for E-GSM900 and DCS1800 Dual Band Handy Phone

File Size 41.30K  /  8 Page

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Amphenol Communications Solutions

Part No. 89038-103LF
Description Metral® Board Connectors, Backplane Connectors 4 Row Signal Receptacle, Right Angle, Press Peg.
Tech specs    

Official Product Page

For 50055-8103 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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