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  43045-0817 Datasheet PDF File

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    43045-0600

Molex Electronics Ltd.
Part No. 43045-0600
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits

File Size 190.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-1628

Molex Electronics Ltd.
Part No. 43045-1628
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 16 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 16 Circuits

File Size 166.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-S08-17LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions
Tech specs    

Official Product Page

    43045-0420

Molex Electronics Ltd.
Part No. 43045-0420
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 4 Circuits

File Size 175.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-F08-17LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    43045-1810

Molex Electronics Ltd.
Part No. 43045-1810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits

File Size 180.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 108-1711-100
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, With Post, No Key.
Tech specs    

Official Product Page

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 59202-F40-08-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.78K  /  3 Page

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Amphenol Communications Solutions

Part No. 54101-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 54201-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-1817

Molex Electronics Ltd.
Part No. 43045-1817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits

File Size 174.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 54102-T0817LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits

File Size 180.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-111081700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 43045-0817 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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