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  1118-4830 Datasheet PDF File

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    1118-4787 11-18-4787

Molex Electronics Ltd.
Part No. 1118-4787 11-18-4787
Description Conductor Punch

File Size 22.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 10117948-3040HLF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1118-4799 11-18-4799

Molex Electronics Ltd.
Part No. 1118-4799 11-18-4799
Description Insulation Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-11108LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 8 Positions
Tech specs    

Official Product Page

    D1118

Fuji Electric
Part No. D1118
Description Search --To 2SD1118

File Size 130.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-11111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    Toshiba
Part No. K1118
Description Search --To 2SK1118

File Size 235.24K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114830-11113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    TriQuint Semiconductor, Inc.
Part No. TGA4830-EPU
Description Wideband Low Noise Amplifier 0 MHz - 45000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER

File Size 715.70K  /  9 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4830-EPU
Description Wideband Low Noise Amplifier

File Size 713.43K  /  9 Page

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Amphenol Communications Solutions

Part No. 10114830-11110LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 10 Positions
Tech specs    

Official Product Page

    SPA-1118 SPA-1118Z

SIRENZA MICRODEVICES
Part No. SPA-1118 SPA-1118Z
Description 850 MHz 1 Watt Power Amplifier with Active Bias

File Size 105.73K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs    

Official Product Page

    HDSP-4820 HDSP-4830 HDSP-4832 HDSP-4840 HDSP-4850

AVAGO TECHNOLOGIES LIMITED
Part No. HDSP-4820 HDSP-4830 HDSP-4832 HDSP-4840 HDSP-4850
Description 10-Element Bar Graph Array

File Size 552.09K  /  8 Page

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Amphenol Communications Solutions

Part No. 77311-483-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1118-5062 0011-18-5062

Molex Electronics Ltd.
Part No. 1118-5062 0011-18-5062
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10117948-3010HLF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

    11-18-5069 0011-18-5069 1118-5069

Molex Electronics Ltd.
Part No. 11-18-5069 0011-18-5069 1118-5069
Description Conductor Punch

File Size 14.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 10117948-3060HLF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

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