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| Part No. |
AN-9037
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| OCR Text |
...he center of the package which solder directl y to the printed wiring board (pwb) and allow modularity in package design, single and mult...wick, the pads cleaned and new paste printed with a mini stencil. localized hot air can then be a... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
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it Online |
Download Datasheet
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| Part No. |
AN-9040
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| OCR Text |
...he center of the package which solder directly to the printed wiring board (pwb) and allows a more direct thermal and electrical path fro...wick, the pads cleaned and new paste printed with a mini stencil. localized hot air can then be a... |
| Description |
Power33 Packaging
|
| File Size |
299.73K /
7 Page |
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it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9046
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| OCR Text |
...he center of the package which solder directly to the printed wiring board (pwb). modularity in package design, single and multi-die pac...wick, the pads cleaned and new paste printed with a mini stencil. localized hot air can then be a... |
| Description |
Dual Power56 Packaging
|
| File Size |
850.15K /
10 Page |
View
it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9048
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| OCR Text |
...he center of the package which solder directl y to the printed wiring board (pwb) and allow modularity in package design, single and mult...wick, the pads cleaned and new paste printed with a mini stencil. localized hot air can then be a... |
| Description |
6x6 DriverMOS Packaging
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| File Size |
746.79K /
9 Page |
View
it Online |
Download Datasheet |
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