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silica Datasheet PDF File

For silica Found Datasheets File :: 1854 Search Time::1.938ms
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				MAXIM[Maxim Integrated Products]
Part No.	MAX1567ETL
OCR Text	... Gold (1.3 mil dia.) Epoxy with silica filler # 05-9000-0520 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bon...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	126.18K / 8 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX5306 MAX5307 MAX5308 MAX5309 MAX5309EUE
OCR Text	...xy Gold (1 mil dia.) Epoxy with silica filler #05-3901-0002 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bond...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	95.10K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX5307EUE
OCR Text	...xy Gold (1 mil dia.) Epoxy with silica filler #05-3901-0002 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bond...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	97.49K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC226
OCR Text	...STRESS INJECTION MOLDED PLASTIC silica AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6....
Description	GaAs MMIC 3V SOT26 TRANSMIT/RECEIVE SWITCH/ DC - 2.0 GHz GaAs MMIC 3V SOT26 TRANSMIT/RECEIVE SWITCH, DC - 2.0 GHz
File Size	171.68K / 6 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	MAX1820ZEUB
OCR Text	... Gold (1.3 mil dia.) Epoxy with silica filler Buildsheet # 05-2301-0048 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	136.36K / 8 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 Hittite Microwave Corporation
Part No.	HMC207S8
OCR Text	...STRESS INJECTION MOLDED PLASTIC silica AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6....
Description	50000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs MMIC SMT DOUBLEBALANCED MIXER, 0.7 - 2.0 GHz
File Size	161.14K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC219MS8
OCR Text	...STRESS INJECTION MOLDED PLASTIC silica AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6....
Description	GaAs MMIC SMT DOUBLEBALANCED MIXER, 4.5 - 9 GHz
File Size	171.31K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC385LP4
OCR Text	...STRESS INJECTION MOLDED PLASTIC silica AND SILICON IMPREGNATED. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUM...
Description	MMIC VCO w/ BUFFER AMPLIFIER, 2.25 - 2.5 GHz
File Size	262.94K / 6 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	HFBR-5527
OCR Text	...iber (POF), and with Large Core silica Fiber (HCS(R)) * Transmitter and Receiver Application Circuit Schematics Available * Conductive Plastic Housing Provides Electrical Shield Description The 125 MBd transceiver is a cost-effective fi...
Description	125 Megabaud Fiber Optic Transceiver JIS FO7 Connection
File Size	363.30K / 12 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 Hittite Microwave Corporation
Part No.	HMC183QS24
OCR Text	...STRESS INJECTION MOLDED PLASTIC silica AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6....
Description	GaAs MMIC SP8T NON-REFLECTIVE SWITCH/ DC - 2.0 GHz GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2.0 GHz
File Size	210.70K / 4 Page	View it Online	Download Datasheet

For silica Found Datasheets File :: 1854 Search Time::1.938ms
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