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    IMX51AEC MCIMX516AJM6C MCIMX514AJM6C

Freescale Semiconductor, Inc
Freescale Semiconductor, In...
Part No. IMX51AEC MCIMX516AJM6C MCIMX514AJM6C
OCR Text ...nd display, audio playback and ripping, and many other applications. i.mx51a automotive and infotainment applications processors 1. introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. ordering inf...
Description i.MX51A Automotive and infotainment applications processors

File Size 1,477.90K  /  175 Page

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    TK130F06K3

Toshiba Semiconductor
Part No. TK130F06K3
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) After opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5C to 30C and RH70% or below. Perform reflow at most twice. (4) The moisture...
Description Swiching Regulator,DC-DC Converter Applications Motor Drive Applications

File Size 206.99K  /  7 Page

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    CIRRUS LOGIC INC
Part No. CS98010-CQ
OCR Text ...r, aac decoder ? mp-3 encoder, ripping controller ordering information cs98000-cq 0 to 70 c 208-pin cs98010-cq 0 to 70 c 128-pin memory controller sdram control flash control risc-1 i-cache d-cache mmu mac risc-2 i-cache d-cache mmu mac ...
Description SPECIALTY CONSUMER CIRCUIT, PQFP128

File Size 325.79K  /  40 Page

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    MCIMX356AJQ4C MCIMX356AJQ5C MCIMX351AJQ4C MCIMX355AJQ4C MCIMX351AJQ5C MCIMX355AJQ5C

Freescale Semiconductor, Inc
Part No. MCIMX356AJQ4C MCIMX356AJQ5C MCIMX351AJQ4C MCIMX355AJQ4C MCIMX351AJQ5C MCIMX355AJQ5C
OCR Text ...l and playback -- High-speed CD ripping to USB, SD/MMC or HDD for virtual CD changer -- Audio processing for hands-free telephony: Bluetooth, AEC/NS, and microphone beam forming -- Speech recognition A/V connectivity and navigation: -- Incl...
Description i.MX35 Applications Processors for Automotive Products

File Size 2,427.40K  /  148 Page

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    MCIMX514AJM6C MCIMX516AJM6C IMX51A10

Freescale Semiconductor, Inc
Part No. MCIMX514AJM6C MCIMX516AJM6C IMX51A10
OCR Text ...and display, audio playback and ripping, and many other applications. 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. ...
Description i.MX51A Automotive and Infotainment Applications Processors

File Size 2,102.88K  /  172 Page

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    PCIMX511AJM6C PCIMX514AJM6C PCIMX516AJM6C IMX51A

Freescale Semiconductor, Inc
Part No. PCIMX511AJM6C PCIMX514AJM6C PCIMX516AJM6C IMX51A
OCR Text ...and display, audio playback and ripping, and many other applications. 2 3 4 5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . ...
Description i.MX51A Automotive and Infotainment Applications Processors

File Size 1,693.01K  /  160 Page

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    TK50F15J1

Toshiba Semiconductor
Part No. TK50F15J1
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description Switching Voltage Regulators

File Size 323.61K  /  10 Page

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    TJ100F04M3L

Toshiba Semiconductor
Part No. TJ100F04M3L
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description MOSFETs

File Size 279.69K  /  10 Page

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    TJ100F06M3L

Toshiba Semiconductor
Part No. TJ100F06M3L
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description MOSFETs

File Size 291.76K  /  10 Page

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    TJ150F04M3L

Toshiba Semiconductor
Part No. TJ150F04M3L
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description MOSFETs

File Size 276.94K  /  10 Page

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