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					Freescale Semiconductor, Inc Freescale Semiconductor, In...
Part No.	IMX51AEC MCIMX516AJM6C MCIMX514AJM6C
OCR Text	...nd display, audio playback and ripping, and many other applications. i.mx51a automotive and infotainment applications processors 1. introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. ordering inf...
Description	i.MX51A Automotive and infotainment applications processors
File Size	1,477.90K / 175 Page	View it Online	Download Datasheet

					Toshiba Semiconductor
Part No.	TK130F06K3
OCR Text	...rop the packed devices to avoid ripping of the bag. (3) After opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5C to 30C and RH70% or below. Perform reflow at most twice. (4) The moisture...
Description	Swiching Regulator,DC-DC Converter Applications Motor Drive Applications
File Size	206.99K / 7 Page	View it Online	Download Datasheet

					CIRRUS LOGIC INC
Part No.	CS98010-CQ
OCR Text	...r, aac decoder ? mp-3 encoder, ripping controller ordering information cs98000-cq 0 to 70 c 208-pin cs98010-cq 0 to 70 c 128-pin memory controller sdram control flash control risc-1 i-cache d-cache mmu mac risc-2 i-cache d-cache mmu mac ...
Description	SPECIALTY CONSUMER CIRCUIT, PQFP128
File Size	325.79K / 40 Page	View it Online	Download Datasheet

					Freescale Semiconductor, Inc
Part No.	MCIMX356AJQ4C MCIMX356AJQ5C MCIMX351AJQ4C MCIMX355AJQ4C MCIMX351AJQ5C MCIMX355AJQ5C
OCR Text	...l and playback -- High-speed CD ripping to USB, SD/MMC or HDD for virtual CD changer -- Audio processing for hands-free telephony: Bluetooth, AEC/NS, and microphone beam forming -- Speech recognition A/V connectivity and navigation: -- Incl...
Description	i.MX35 Applications Processors for Automotive Products
File Size	2,427.40K / 148 Page	View it Online	Download Datasheet

					Freescale Semiconductor, Inc
Part No.	MCIMX514AJM6C MCIMX516AJM6C IMX51A10
OCR Text	...and display, audio playback and ripping, and many other applications. 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. ...
Description	i.MX51A Automotive and Infotainment Applications Processors
File Size	2,102.88K / 172 Page	View it Online	Download Datasheet

					Freescale Semiconductor, Inc
Part No.	PCIMX511AJM6C PCIMX514AJM6C PCIMX516AJM6C IMX51A
OCR Text	...and display, audio playback and ripping, and many other applications. 2 3 4 5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . ...
Description	i.MX51A Automotive and Infotainment Applications Processors
File Size	1,693.01K / 160 Page	View it Online	Download Datasheet

					Toshiba Semiconductor
Part No.	TK50F15J1
OCR Text	...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description	Switching Voltage Regulators
File Size	323.61K / 10 Page	View it Online	Download Datasheet

					Toshiba Semiconductor
Part No.	TJ100F04M3L
OCR Text	...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description	MOSFETs
File Size	279.69K / 10 Page	View it Online	Download Datasheet

					Toshiba Semiconductor
Part No.	TJ100F06M3L
OCR Text	...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description	MOSFETs
File Size	291.76K / 10 Page	View it Online	Download Datasheet

					Toshiba Semiconductor
Part No.	TJ150F04M3L
OCR Text	...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description	MOSFETs
File Size	276.94K / 10 Page	View it Online	Download Datasheet

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