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molybdenum Datasheet PDF File

For molybdenum Found Datasheets File :: 578 Search Time::1.265ms
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				IXYS Corporation
Part No.	DWEP69-12 DWGS04-018A DWGS04-01A DWGS04-025A DWGS04-025C DWEP35-06 DWEP30-10 DWEP6-12 CWP22-CG DWEP50-10 DWEP55-06 DWEP77-02 DWFP17-16_18 DWEP75-06
OCR Text	...nt buffer layer, e.g. tungsten, molybdenum or Trimetal(R), for strain relief should be considered. An alternative solution is to soft-solder these larger chips to DCB ceramic substrates because of their matching thermal expansion coefficien...
Description	Rectifier Diodes & FRED
File Size	757.98K / 22 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	UM9441_06 UM9441 UM944106
OCR Text	...ing the PIN chip in between two molybdenum refractory pins that are typically 0.125 inches in diameter and 0.050 inches long. Hyper-pure glass is then fused over this bond to form a void less seal. Leads are then brazed to ends of molybdenu...
Description	PIN RADIATION DETECTORS
File Size	192.83K / 4 Page	View it Online	Download Datasheet

				TriQuint Semiconductor,Inc. TRIQUINT[TriQuint Semiconductor]
Part No.	TGF4124-EPU TGF4124
OCR Text	...With a .020" CM15 (15/85 Copper molybdenum) carrier plate solder attached using 0.0015" AuSn (80/20) solder Channel Temperature (C) Pd = 7 Watts Pd = 13 Watts 45 55 65 75 85 95 105 115 125 Base Plate Temperature (C) Tch = 0.6458...
Description	24 mm Discrete HFET
File Size	153.35K / 9 Page	View it Online	Download Datasheet

				TriQuint Semiconductor,Inc. TRIQUINT[TriQuint Semiconductor]
Part No.	TGF4118-EPU TGF4118
OCR Text	...With a .020" CM15 (15/85 Copper molybdenum) carrier plate solder attached using 0.0015" AuSn (80/20) solder Channel Temperature (C) Pd = 5 Watts Pd = 10 Watts 35 45 55 65 75 85 95 105 115 125 Base Plate Temperature (C) Tc = 2.052 +...
Description	18 mm Discrete HFET
File Size	151.94K / 9 Page	View it Online	Download Datasheet

				TriQuint Semiconductor,Inc. TRIQUINT[TriQuint Semiconductor]
Part No.	TGF4112-EPU TGF4112
OCR Text	...With a .020" CM15 (15/85 Copper molybdenum) carrier plate solder attached using 0.0015" AuSn (80/20) solder Channel Temperature (C) Pd = 3.5 Watts Pd = 7 Watts 45 55 65 75 85 95 105 115 125 Base Plate Temperature (C) Tch = 1.67 ...
Description	12 mm Discrete HFET
File Size	153.36K / 9 Page	View it Online	Download Datasheet

				NPC[Nippon Precision Circuits Inc]
Part No.	SM5168BAV
OCR Text	...s a PLL ICs fabricated in NPC's molybdenum-gate CMOS process. This is designed for use in transmitter/receiver stages in mobile telephones and similar applications. And it built in LD pin of lock detect signal output. PINOUT 16-pin VSOP...
Description	PLL Frequency Symthesizer ICs
File Size	27.44K / 2 Page	View it Online	Download Datasheet

				NPC[Nippon Precision Circuits Inc]
Part No.	SM5842AP SM5842APT SM5842
OCR Text	...lter IC, fabricated using NPC's molybdenum-gate CMOS process, for digital audio reproduction equipment. It features 8-times oversampling (interpolation), independent left and right-channel digital deemphasis, and soft muting functions. It a...
Description	High-Class Audio Multi-function Digital Filter
File Size	198.78K / 23 Page	View it Online	Download Datasheet

				IXYS[IXYS Corporation]
Part No.	DWEP17-12 CWP21-CG DWS14-45A DWS19-15B DWS24-45A DWS33-45B DWS37-30B DWS17-30B DWS217-30B DWS23-45B DWS27-30B DWS29-15B DWS39-08D DWS9-15B CWP130 CWP16-CG CWP180 CWP24 CWP25-CG CWP339 CWP341 CWP345 CWP347 CWP35 CWP41 CWP50 CWP55 CWP69 CWP71 CWP7-CG CWP8 CWP8-CG DLFP150-17S DLFP15-16F DLFP15-18F DLFP200-17S DLFP25-16F DLFP25-18F DLFP55-16F DLFP55-17S DLFP55-18F DLFP68-16F DLFP68-17S DLFP68-18F DWEP-06 DWEP10-10 DWEP12-06 DWEP15-06 DWEP18-10 DWEP19-12 DWEP20-10 DWEP23-06 DWEP25-06 DWEP27-02 DWEP29-12 DWEP3-10 DWEP49-12 DWEP9-12 DWFN17-16_18 DWFN21-16_18 DWFN35-16_18 DWGS04-018C DWGS04-03A DWGS04-03C DWGS10-018A DWGS10-018C DWGS10-01C DWGS10-025A DWGS10-025C DWGS10-03A DWGS10-03C DWGS20-018A DWGS20-018C DWGS20-025A DWGS20-025C DWGS20-03C DWHFP150-12S DWHFP15-12F DWHFP23-12F DWHFP56-12F DWHFP56-12S DWHFP69-12F DWHFP69-12S DWHP150-06F DWHP15-06F DWHP23-06F DWHP56-06F DWHP69-06F DWHP8-06F DWLP150-04 DWLP15-02 DWLP15-02B DWLP15-03 DWLP15-03A DWLP15-04 DWLP15-06A DWLP15-06B DWLP15-12 DWLP23-03 DWLP23-03A DWLP23-04 DWLP23-06A DWLP23-06B DWLP23-12 DWLP25-02 DWLP4-02 DWLP4-03 DWLP4-06 DWLP55-03 DWLP55-04 DWLP55-06 DWLP55-12 DWLP75-03 DWLP75-04 DWLP75-06 DWLP75-12 DWLP8-03 DWLP8-04 DWLP8-06A D
OCR Text	...nt buffer layer, e.g. tungsten, molybdenum or Trimetal(R), for strain relief should be considered. An alternative solution is to soft-solder these larger chips to DCB ceramic substrates because of their matching thermal expansion coefficien...
Description	Rectifier Diodes & FRED
File Size	593.57K / 22 Page	View it Online	Download Datasheet

				CELERITEK Electronic Theatre Controls, Inc. List of Unclassifed Manufacturers ETC
Part No.	CMM1331-KU
OCR Text	... Unconditionally Stable Copper/molybdenum Flange Package for Optimum Thermal Dissipation Applications Ku-Band VSAT Transmit Subsystems Vdd 1 GROUND 2 10 Vdd 9 GROUND 8 RF OUT 7 GROUND 6 Vgg Description The CMM1331-KU is a four-s...
Description	12.7 to 13.5 GHz, 1.5 watt power amplifier 12.70 to 13.50 GHz 1.5 Watt Power Amplifier 12700 MHz - 13500 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
File Size	371.38K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC28310
OCR Text	...die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. typical...
Description	GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz
File Size	341.83K / 8 Page	View it Online	Download Datasheet

For molybdenum Found Datasheets File :: 578 Search Time::1.265ms
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