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  MC33761SNT1-030 Datasheet PDF File

For MC33761SNT1-030 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Samtec, Inc
Part No. QSH-030-01-L-D-A-K QSH-040-01-L-D-DP-A
Description HIGH SPEED GROUND PLANE SOCKET

File Size 1,053.04K  /  1 Page

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HUA FENG CIRCUIT





    14-56-8030

Molex Electronics Ltd.
Part No. 14-56-8030
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 22, 0.76μm (30μ) Gold (Au), 3 Circuits

File Size 163.90K  /  3 Page

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Part No. 5030-11
Description INTERCONNECTION DEVICE

File Size 36.60K  /  1 Page

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    22-28-1030

Molex Electronics Ltd.
Part No. 22-28-1030
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 3 Circuits, Tin (Sn) Plating

File Size 311.12K  /  8 Page

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    15-80-0303

Molex Electronics Ltd.
Part No. 15-80-0303
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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    0306-2

Lumberg
Part No. 0306-2
Description Leiterplattenlayouts siehe Seite 3.63

File Size 177.40K  /  3 Page

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    Molex, Inc.
Part No. 08-03-0303
Description Crimp Socket Contact; Wire Size (AWG):24-18; Contact Material:Brass RoHS Compliant: Yes BRASS, TIN LEAD FINISH, WIRE TERMINAL

File Size 96.04K  /  2 Page

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    22-28-0030

Molex Electronics Ltd.
Part No. 22-28-0030
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating

File Size 66.19K  /  2 Page

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    Asahi Kasei Microsystem...
Part No. MS-0030
Description Semiconductor Magnetoresistive Element

File Size 386.25K  /  8 Page

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Part No. 1030-NS
Description LOGIC OUTPUT PHOTO DETECTOR

File Size 552.48K  /  6 Page

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Part: MC33761SNT1-030
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