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Molex Electronics Ltd.
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| Part No. |
70280-0068 A-70280-0068 0010897562 010-89-7562
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
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| File Size |
421.87K /
4 Page |
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it Online |
Download Datasheet
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Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
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| Part No. |
HKS035-85GG KEA019-131T KES005-85GG
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| Description |
35 POS PEEL-A-WAY® STAGGERED TRIPLE ROW SOCKET ZIP35, IC SOCKET 19 POS PEEL-A-WAY® STAGGERED DUAL ROW ADAPTER ZIP19, IC SOCKET 5 POS PEEL-A-WAY® STAGGERED DUAL ROW SOCKET
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| File Size |
161.50K /
2 Page |
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it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet
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Price and Availability
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