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Winbond Electronics, Corp.
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| Part No. |
W24010A
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| Description |
128K×8 High-Speed CMOS Static RAM(128K×8位高速CMOS静态RAM) 8 × 128K的高速CMOS静态RAM28K的8位高速的CMOS静态RAM）的
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| File Size |
224.94K /
10 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
HD3SS3220RNHT
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| Description |
10Gbps USB 3.1 Type-C 2:1 Mux with DRP Controller 30-WQFN 0 to 70
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
HD3SS3220IRNHT
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| Description |
10Gbps USB 3.1 Type-C 2:1 Mux with DRP Controller 30-WQFN -40 to 85
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10141240-101LF
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| Description |
ExaMAX+®,Backplane Connectors, - 8-Pair, 16 column, 416 position, Right Angle Orthogonal Header, No Guide Pin
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10082202-401-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Double row , 6 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Winbond Electronics, Corp.
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| Part No. |
W24010AC
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| Description |
128K×8 High-Speed CMOS Static RAM(128K×8位高速CMOS静态RAM) 8 × 128K的高速CMOS静态RAM28K的8位高速的CMOS静态RAM）的
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| File Size |
151.15K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-401080800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10160920-1240100LF
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| Description |
Minitek® Pwr 3.0, CEM5 Right Angle Through Hole Hybrid Header (12Power + 4 Signal), Tin Plating, GW Compatible LCP, Black Color.
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
BQ24010DRCR
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| Description |
bqTINY™ Linear 1-cell Li-Ion Charger w/ 1-A FET, AC Present and Temp Sense in QFN-10 10-VSON -40 to 85
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| Tech specs |
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Get Free Sample |
Official Product Page
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Price and Availability
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