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  double-mold Datasheet PDF File

For double-mold Found Datasheets File :: 791    Search Time::1.968ms    
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    MC10E193 MC10E193FN MC100E193FN ON0639 MC100E193

ONSEMI[ON Semiconductor]
Motorola, Inc
Part No. MC10E193 MC10E193FN MC100E193FN ON0639 MC100E193
OCR Text ...ECDED (single error correction, double error detection) error system can be designed for a multiple of an 8-bit word. MC10E193 MC100E193 ...MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND...
Description From old datasheet system
ERROR DETECTION/ CORRECTION CIRCUIT

File Size 108.91K  /  4 Page

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    SK1901 SK1929 SK1926 SK1900 SK1904 SK1928 SK1999 SK1902 SK1903 SK1925 SK1927 SK1930

SEMTECH[Semtech Corporation]
Part No. SK1901 SK1929 SK1926 SK1900 SK1904 SK1928 SK1999 SK1902 SK1903 SK1925 SK1927 SK1930
OCR Text ...l l l l Output Configuration 50 Double Termination Internal Current Sink (Double Termination) ECL / PECL Double Swing / TTL ECL / PECL ECL /...mold protrusion. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic body size d...
Description 1:9 Signal Distribution

File Size 925.88K  /  30 Page

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    UPC2712T UPC2712T-E3

NEC Corp.
NEC[NEC]
Part No. UPC2712T UPC2712T-E3
OCR Text ... * Mounted on 50 x 50 x 1.6 mm double sided copper clad epoxy glass PWB (TA = +85 C) RECOMMENDED OPERATING CONDITIONS PARAMETER Supply ...MOLD PACKAGE DIMENSIONS (Unit: mm) 0.3 +0.1 -0.05 0.130.1 1 2.8 -0.3 1.5 -0.1 +0.2 +0.2 2 ...
Description 2.6 GHz WIDE BAND AMPLIFIER SILICON BIPOLAR MONOLITHIC INTEGRATED CIRCUIT

File Size 157.25K  /  12 Page

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    UPC2713T UPC2713T-E3

NEC
Part No. UPC2713T UPC2713T-E3
OCR Text ... * Mounted on 50 50 1.6 mm double copper clad epoxy glass PWB (TA = +85 C) RECOMMENDED OPERATING CONDITIONS PARAMETER Supply Voltag...MOLD PACKAGE DIMENSIONS (Unit: mm) 0.3 -0.05 +0.1 0.130.1 1 2 3 2.8 -0.3 1.5 -0....
Description 1.2 GHz LOW NOISE WIDE BAND AMPLIFIER SILICON BIPOLAR MONOLITHIC INTEGRATED CIRCUIT

File Size 185.29K  /  12 Page

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    UPC2747TB UPC2747TB-E3 UPC2748TB UPC2748TB-E3

NEC[NEC]
Part No. UPC2747TB UPC2747TB-E3 UPC2748TB UPC2748TB-E3
OCR Text ... TA = +25C TA = +25C Mounted on double sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C) Conditions Ratings 4.0 15 200 -40 to +...MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E). Data Sheet ...
Description 3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS

File Size 116.65K  /  20 Page

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    UPC2749TB UPC2749TB-E3

NEC[NEC]
Part No. UPC2749TB UPC2749TB-E3
OCR Text ...pF Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through...MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E). 6 Data S...
Description 3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS

File Size 89.85K  /  16 Page

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    UPC8119T UPC8119T-E3 UPC8120T UPC8120T-E3 UPC8131TA UPC2723T

NEC[NEC]
Part No. UPC8119T UPC8119T-E3 UPC8120T UPC8120T-E3 UPC8131TA UPC2723T
OCR Text ...it V mA C Tstg PD Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB TA = +85C -55 to +150 280 C mW RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Symbol VCC MIN. 2.7 TYP. 3.0 MAX. 3.3 Unit V Notice...
Description VARIABLE GAIN AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE

File Size 546.66K  /  52 Page

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    CXL1517N CXL1518N CXL1517

SONY[Sony Corporation]
Part No. CXL1517N CXL1518N CXL1517
OCR Text ...uits * Built-in CDS (Correlated Double Sampling) circuit Functions * Clock driver * Autobias circuit (Center and black) * Pedestal clamp cir...mold protrusion. DETAIL A PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP...
Description CMOS-CCD Signal Processor

File Size 100.52K  /  7 Page

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    MAX2104CCM

MAXIM[Maxim Integrated Products]
Part No. MAX2104CCM
OCR Text ...S Application GST2 - High Speed Double Poly-Silicon Bipolar Process C. Number of Device Transistors: D. Fabrication Location: E. Assembly...Mold Material: G. Assembly Diagram: H. Flammability Rating: 48-Lead TQFP Copper Solder Plate Silver-...
Description PLASTIC ENCAPSULATED DEVICES

File Size 90.36K  /  7 Page

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    SK1530 SK1525 SK1528 SK1500 SK1599 SK1501 SK1502 SK1503 SK1504 SK1527 SK1529 SK15XXFAMILY

SEMTECH[Semtech Corporation]
Part No. SK1530 SK1525 SK1528 SK1500 SK1599 SK1501 SK1502 SK1503 SK1504 SK1527 SK1529 SK15XXFAMILY
OCR Text ...l l l l Output Configuration 50 Double Termination Internal Current Sink (Double Termination) ECL / PECL Double Swing / TTL ECL / PECL ECL /...mold protrusion. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic body size d...
Description 1:5 Signal Distribution

File Size 717.84K  /  30 Page

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For double-mold Found Datasheets File :: 791    Search Time::1.968ms    
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