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  90136-1318 Datasheet PDF File

For 90136-1318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2310

Molex Electronics Ltd.
Part No. 90136-2310
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-8214-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2132

Molex Electronics Ltd.
Part No. 90136-2132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-2125

Molex Electronics Ltd.
Part No. 90136-2125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-8218-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    90136-1206

Molex Electronics Ltd.
Part No. 90136-1206
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8614-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    90136-1202

Molex Electronics Ltd.
Part No. 90136-1202
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8316-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-1322

Molex Electronics Ltd.
Part No. 90136-1322
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8618-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-2215

Molex Electronics Ltd.
Part No. 90136-2215
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-8414-21H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    RM-1318-H RM-1318-L RM-1318-M

Reed Relays and Electronics
Part No. RM-1318-H RM-1318-L RM-1318-M
Description Reduced-miniature Reed Switch

File Size 87.33K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-8316-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    SPA-1318

Stanford Microdevices
Part No. SPA-1318
Description 2150 MHz 1 Watt Power Amplifier with Active Bias

File Size 219.37K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-8618-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    SIRENZA[SIRENZA MICRODEVICES]
Part No. SPA-1318
Description 2150 MHz 1 Watt Power Amplifier with Active Bias

File Size 84.61K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-8414-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 90136-1318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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