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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136162-101LF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 8 column, 160 position, Right Angle Header, No Guide Pin.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136164-101LF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 12 column, 240 position, Right Angle Header, No Guide Pin.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-808361650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136161-101LF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 6 column, 120 position, Right Angle Header, No Guide Pin.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10136160-12JLF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 4-Pair, 10 column, 140 position, Right Angle Header, Left Guide Pin.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879145016 87914-5016
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.55K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10113616-01231LF
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| Description |
Modular Jack, Input Output Connectors, Multi-ports Ganged RJ45, right angle, Through Mount, shielded, 8 Positions, 8 Ports
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10136160-11JLF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 4-Pair, 10 column, 140 position, Right Angle Header, Right Guide Pin.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3616-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-T36-16-109LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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