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  87759-2250 Datasheet PDF File

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    87759-3214

Molex Electronics Ltd.
Part No. 87759-3214
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.10K  /  8 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    87759-4014

Molex Electronics Ltd.
Part No. 87759-4014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 563.47K  /  11 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1615

Molex Electronics Ltd.
Part No. 87759-1615
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 279.46K  /  6 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

    87759-4015

Molex Electronics Ltd.
Part No. 87759-4015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 383.21K  /  9 Page

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Amphenol Communications Solutions
Part No. 54242-411322250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-3014

Molex Electronics Ltd.
Part No. 87759-3014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.16K  /  8 Page

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Amphenol Communications Solutions
Part No. 54121-112222500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-4076

Molex Electronics Ltd.
Part No. 87759-4076
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-112122500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    87759-4465

Molex Electronics Ltd.
Part No. 87759-4465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.27K  /  6 Page

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Amphenol Communications Solutions
Part No. 10128483-122500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 2-pair, 25 column, 22.5mm Plug Height.
Tech specs 　 　

Official Product Page

    87759-3864

Molex Electronics Ltd.
Part No. 87759-3864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
File Size 420.91K  /  8 Page

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Amphenol Communications Solutions
Part No. 10127225-122502ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 19 Column, 152 Position, 22.50mm Stack Height, 2.00mm (0.079in) Column Pitch
Tech specs 　 　

Official Product Page

    87759-4215

Molex Electronics Ltd.
Part No. 87759-4215
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 279.39K  /  6 Page

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Amphenol Communications Solutions
Part No. 348-5225-065
Description GbX ,Backplane connectors,3 pair U, 25 position, right, 5.55mm, Header
Tech specs 　 　

Official Product Page

    87759-3875

Molex Electronics Ltd.
Part No. 87759-3875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,
File Size 280.29K  /  6 Page

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Amphenol Communications Solutions
Part No. 54112-110082250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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