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N8050 260101B 2SA965Y 0N60B2 B82627 AJ3SX8Y8 L50S040 D4021BC
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  87381-3218 Datasheet PDF File

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    87381-0864

Molex Electronics Ltd.
Part No. 87381-0864
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38μm (15μ) Gold (Au) Plating, with Cap, without Locating Pegs, 8 Circuits, Lead-free
File Size 315.39K  /  6 Page

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Amphenol Communications Solutions
Part No. RJSGE4887381
Description Modular Jack - 8P8C, Right Angle, Cat5e, Four Port, Stacked, 2x2, Shield With Top and Side EMI Tabs, With LEDs, Press-fit Contacts
Tech specs 　 　

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HUA FENG CIRCUIT





    87381-2417

Molex Electronics Ltd.
Part No. 87381-2417
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76μm (30μ)Gold (Au) Plating, without Cap, with Locating Peg, 24 Circuits, Leadfree
File Size 113.91K  /  3 Page

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Amphenol Communications Solutions
Part No. RJE4W4887381
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e, Stacked 2x2, Shield, With LEDs
Tech specs 　 　

Official Product Page

    87381-2463

Molex Electronics Ltd.
Part No. 87381-2463
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76μm (30μ) Gold (Au) Plating, with Cap, without Locating Pegs, 24 Circuits, Lead-free
File Size 315.32K  /  6 Page

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Texas Instruments
Part No. CSD87381PT
Description 30V, Nch synchronous buck NexFET MOSFET&trade;, 3x2.5 LGA, 15A 5-PTAB -55 to 150
Tech specs 　 　

Official Product Page

    87381-5063

Molex Electronics Ltd.
Part No. 87381-5063
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76μm (30μ) Gold (Au) Plating, with Cap, without Locating Pegs, 50 Circuits, Lead-free
File Size 315.39K  /  6 Page

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Texas Instruments
Part No. CSD87381P
Description 30V, Nch synchronous buck NexFET MOSFET&trade;, 3x2.5 LGA, 15A 5-PTAB -55 to 150
Tech specs 　 　

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Official Product Page

    87381-2863

Molex Electronics Ltd.
Part No. 87381-2863
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76μm (30μ)Gold (Au) Plating, with Cap, without Locating Pegs, 28 Circuits, Lead-free
File Size 315.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 68683-218LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87381-4017

Molex Electronics Ltd.
Part No. 87381-4017
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76um (30u) Gold (Au) Plating
File Size 114.04K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    87381-4600

Molex Electronics Ltd.
Part No. 87381-4600
Description 2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Surface Mount, Top Entry, 0.38μm (15μ) Gold (Au) Plating, with Cap version, Tape on Reel, 46 Circuits, Lead free
File Size 315.37K  /  6 Page

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Amphenol Communications Solutions
Part No. RJMG133218101DR
Description RJMG, Input output Connectors, 10/100 stack single USB 2.0, with led
Tech specs 　 　

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    87381-2818

Molex Electronics Ltd.
Part No. 87381-2818
Description 2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38um (15u") Gold (Au) Plating
File Size 114.29K  /  3 Page

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Amphenol Communications Solutions
Part No. 88903-218LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod
Tech specs 　 　

Official Product Page

    15-45-3218

Molex Electronics Ltd.
Part No. 15-45-3218
Description 2.54mm (.100) Pitch C-Grid? PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 18 Circuits
File Size 736.30K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-411321800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    14-56-3218

Molex Electronics Ltd.
Part No. 14-56-3218
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 0.38μm (15μ) Gold (Au), 21 Circuits
File Size 162.80K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-109321800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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