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  73780-0223 Datasheet PDF File

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    73780-3146

Molex Electronics Ltd.
Part No. 73780-3146
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 193.89K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127720-223LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 22 Positions, 15u\\ Gold plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs 　 　

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HUA FENG CIRCUIT





    73780-2163

Molex Electronics Ltd.
Part No. 73780-2163
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.511), Pin Length 4.00mm (.157),
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 68022-372HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73780-1164

Molex Electronics Ltd.
Part No. 73780-1164
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551), Pin Length 4.00mm (.157),
File Size 201.47K  /  3 Page

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Amphenol Communications Solutions
Part No. 68602-234H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73780-2253

Molex Electronics Ltd.
Part No. 73780-2253
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138)
File Size 198.95K  /  3 Page

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Amphenol Communications Solutions
Part No. 68602-234HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73780-2255

Molex Electronics Ltd.
Part No. 73780-2255
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 198.96K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-402-23LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    73780-3145

Molex Electronics Ltd.
Part No. 73780-3145
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 15.00mm (.591), Pin Length 3.00mm (.118),
File Size 198.42K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F02-23LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions
Tech specs 　 　

Official Product Page

    73780-2155

Molex Electronics Ltd.
Part No. 73780-2155
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 10134170-2230LF
Description Minitek® Pwr 4.2, Receptacle Terminal, Tin plating, Chrysocal, AWG(#22-28).
Tech specs 　 　

Official Product Page

    73780-3157

Molex Electronics Ltd.
Part No. 73780-3157
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),
File Size 198.71K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127402-23H1410LF
Description PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 2HP+18S+2HP, Vertical, Press Fit.
Tech specs 　 　

Official Product Page

    73780-0247

Molex Electronics Ltd.
Part No. 73780-0247
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 202.03K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-236HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73780-3147

Molex Electronics Ltd.
Part No. 73780-3147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 193.90K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-230HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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