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  70567-0120 Datasheet PDF File

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    15-80-0101 70567-0003 A-70567-0003 0015800101

Molex Electronics Ltd.
Part No. 15-80-0101 70567-0003 A-70567-0003 0015800101
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.41K  /  7 Page

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Rochester Electronics LLC

Part No. 27C010-120DI
Description 27C010 - 1024K (128K x 8) CMOS EPROM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-80-0105 0015800105 A-70567-0139

Molex Electronics Ltd.
Part No. 15-80-0105 0015800105 A-70567-0139
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 10120818-001CLF
Description SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
Tech specs    

Official Product Page

    15-80-0107 0015800107 A-70567-0207

Molex Electronics Ltd.
Part No. 15-80-0107 0015800107 A-70567-0207
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.53K  /  7 Page

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Amphenol Communications Solutions

Part No. 76350-120-22LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 93690-101-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 75970-120-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 68001-205HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800147 15-80-0147 A-70567-0209

Molex Electronics Ltd.
Part No. 0015800147 15-80-0147 A-70567-0209
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions

Part No. 51760-10401204AALF
Description PwrBlade®, Power Connectors, 4P 12S 4P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    A-70567-0363 15-80-1501 0015801501

Molex Electronics Ltd.
Part No. A-70567-0363 15-80-1501 0015801501
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 51701-10001202AALF
Description PwrBlade®, Power Supply Connectors, Vertical Header, With Guide Pin 12S 2P
Tech specs    

Official Product Page

    15-80-0109 0015800109 70567-0275 A-70567-0275

Molex Electronics Ltd.
Part No. 15-80-0109 0015800109 70567-0275 A-70567-0275
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. 51762-10201200BALF
Description PwrBlade®, Power Connectors, 2P 12S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    70567-0011 A-70567-0011 0015800261

Molex Electronics Ltd.
Part No. 70567-0011 A-70567-0011 0015800261
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 51742-11301200AALF
Description PwrBlade®, Power Supply Connectors, 13P 12S Vertical Receptacle.
Tech specs    

Official Product Page

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