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  70543-0022 Datasheet PDF File

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    0705430122

Molex Electronics Ltd.
Part No. 0705430122
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0705430123

Molex Electronics Ltd.
Part No. 0705430123
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 19Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430125

Molex Electronics Ltd.
Part No. 0705430125
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430126

Molex Electronics Ltd.
Part No. 0705430126
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 22Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430127

Molex Electronics Ltd.
Part No. 0705430127
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    0705430128

Molex Electronics Ltd.
Part No. 0705430128
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 24 Circuits, 0.76um
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430129

Molex Electronics Ltd.
Part No. 0705430129
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25 Circuits, 0.76um (30u)
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    0705430116

Molex Electronics Ltd.
Part No. 0705430116
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 12Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430124

Molex Electronics Ltd.
Part No. 0705430124
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 20 Circuits, 0.76um (30u)
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-0222LLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing.
Tech specs 　 　

Official Product Page

    70543-0001 0705430001

Molex Electronics Ltd.
Part No. 70543-0001 0705430001
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-0221GLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

For 70543-0022 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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