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Molex, Inc.
MOLEX INC
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| Part No. |
16-02-0083 16-02-0104 16-02-0116
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| Description |
Crimp Socket Contact; Wire Size (AWG):24-22; Contact Plating:Gold; Series:70058; External Depth:0.064"; Operating Temp. Min:-40 C; Pitch Spacing:0.1"; Reel Quantity:20000; Voltage Rating:250V RoHS Compliant: Yes WIRE TERMINAL
Crimp Socket Contact; Wire Size (AWG):24-22; Contact Current:3A RoHS Compliant: Yes
SL Term Crp M 30 SAu 22-24 Reel RoHS Compliant: Yes
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| File Size |
77.55K /
1 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10083987-11023TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51750-083LF
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| Description |
PwrBlade®, Power Supply Connectors, 1P 24S 1P Vertical Receptacle.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G802M008315YAEU
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| Description |
Board mount - Header Plug - Pin Header 1.27mm*1.27mm Pitch Vertical,SMT,2x4Pin,Gold Flash,NY6T,4.0mm*1.0mm_5.5mm,W/CAP
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2506 A-70475-1125
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.76μm (30μ) Gold (Au), 6 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.76μm (30μ) Gold (Au), 6 Circuits
Molex Electronics Ltd.
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| File Size |
148.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10083113-203LF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded vertical header ,Press Fit ,Single row , 3 Positions ,2.54mm (0.100in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G802M008315YAHR
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| Description |
Board mount - Header Plug - Pin Header 1.27mm*1.27mm Pitch Vertical,SMT,2x4Pin,Gold Flash,NY6T,4.0mm*1.0mm_5.5mm,W/CAP
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2505 A-70475-1124
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.76μm (30μ) Gold (Au), 5 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.76μm (30μ) Gold (Au), 5 Circuits
Molex Electronics Ltd.
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| File Size |
148.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10083987-41223TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10083113-116LF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Press Fit, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10083987-11123TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10083113-120LF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Press Fit, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10083113-110LF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Press Fit, Single Row, 10 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail.
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Official Product Page
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Bom2Buy.com
Price and Availability
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