52559-0672 pdf Datasheet P4 Part Num --- IC-ON-LINE


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52559-0672 Datasheet PDF File

For 52559-0672 Found Datasheets File :: 87+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |

					Molex Electronics Ltd.
Part No.	52559-3052 0525593052
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 30 Circuits, Lead-free Gold Contact Plating, High Barrier Packaging
File Size	471.61K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-672
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0525591052
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 10 Circuits, Lead-free,
File Size	472.11K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	76745-106-72LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0525592052
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 20 Circuits, Lead-free,Gold (Au) Plating, High Barrier Packaging
File Size	472.11K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	93690-106-72LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0525594052 52559-4052
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 40 Circuits, Lead-free Gold Contact Plating, High Barrier Packaging Molex Electronics Ltd.
File Size	472.20K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-106721000LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	52559-2852 0525592852
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 28 Circuits, Lead-free,Gold Contact Plating, High Barrier Packaging
File Size	471.62K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-106721050LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0525590952 52559-0952
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 9 Circuits, Lead-free,Gold (Au) Contact Plating, High Barrier Packaging
File Size	471.63K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-106720850LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0525592452
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 24 Circuits, Lead-freeGold Contact Plating, High Barrier Packaging
File Size	471.62K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-672H
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	52559-0652 0525590652
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 6 Circuits, Lead-freeGold Contact Plating, High Barrier Packaging
File Size	472.11K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-106720800LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	52559-0853 0525590853
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 8 Circuits, Lead-freeGold (Au) Contact Plating
File Size	392.69K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-106720950LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	52559-1353 0525591353
Description	0.50mm (.020) Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 13 Circuits, Lead-free,Gold (Au) Contact Plating
File Size	393.29K / 8 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	SN0806723IPNR
Description	Single-phase Metering SoC with 2 Sigma-Delta ADCs, LCD, Real-Time Clock, 64KB Flash, 4KB RAM 80-LQFP -40 to 85
Tech specs			Get Free Sample	Official Product Page

For 52559-0672 Found Datasheets File :: 87+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |

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