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Amphenol Communications Solutions |
| Part No. |
972-402J-G0H
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| Description |
XCede HD2, 4-Pair, 6 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-401E-G0H
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| Description |
XCede HD2, 4-Pair, 6 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-402C-G0H
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| Description |
XCede HD2, 4-Pair, 4 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-402E-G0H
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| Description |
XCede HD2, 4-Pair, 8 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-401C-G0H
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| Description |
XCede HD2, 4-Pair, 8 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0010897241 70280-0012 A-70280-0012 010-89-7241
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| Description |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, Tin (Sn) Plating, 2.72mm (.107) PC Tail Length
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| File Size |
421.71K /
4 Page |
 View
it Online |
Download Datasheet
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|
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Amphenol Communications Solutions |
| Part No. |
972-401J-G0H
|
| Description |
XCede HD2, 4-Pair, 4 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
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|
|
Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-240HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-242HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0010897243 010-89-7243 A-70280-0212
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| Description |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.79mm (.110) PC Tail
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| File Size |
421.76K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67997-244HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-246HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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