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  43650-0509 Datasheet PDF File

For 43650-0509 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43650-0815

Molex Electronics Ltd.
Part No. 43650-0815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 153.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 54101-S0509A08RLF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43650-0820

Molex Electronics Ltd.
Part No. 43650-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical

File Size 169.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 50000-5099ELF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 3 Row, 99 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    43650-0821

Molex Electronics Ltd.
Part No. 43650-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit

File Size 164.47K  /  3 Page

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Amphenol Communications Solutions

Part No. 59202-G32-05-094
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions.
Tech specs    

Official Product Page

    43650-1123

Molex Electronics Ltd.
Part No. 43650-1123
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Press-fit Metal Retention Clip, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 163.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 59132-T36-05-098LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    43650-1124

Molex Electronics Ltd.
Part No. 43650-1124
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 170.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 50000-5096FLF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 3 Row, 96 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    43650-1126

Molex Electronics Ltd.
Part No. 43650-1126
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Glow Wire Compatible

File Size 170.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-105090850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0610

Molex Electronics Ltd.
Part No. 43650-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with PCB

File Size 163.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-S34-05-091
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions.
Tech specs    

Official Product Page

    43650-0422

Molex Electronics Ltd.
Part No. 43650-0422
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 4 Circuits

File Size 164.30K  /  3 Page

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Amphenol Communications Solutions

Part No. 50000-5096ELF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 3 Row, 96 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    43650-0402

Molex Electronics Ltd.
Part No. 43650-0402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 4 Circuits

File Size 161.63K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-105091150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0718

Molex Electronics Ltd.
Part No. 43650-0718
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit

File Size 169.20K  /  3 Page

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Amphenol Communications Solutions

Part No. 50000-5090HLF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 3 Row, 90 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 43650-0509 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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