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  43045-2417 Datasheet PDF File

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    43045-0820

Molex Electronics Ltd.
Part No. 43045-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits
File Size 174.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

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HUA FENG CIRCUIT





    43045-0810

Molex Electronics Ltd.
Part No. 43045-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-0821

Molex Electronics Ltd.
Part No. 43045-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 183.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 76342-417LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-0822

Molex Electronics Ltd.
Part No. 43045-0822
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 183.86K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

    43045-0823

Molex Electronics Ltd.
Part No. 43045-0823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row,
File Size 183.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-150HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

    43045-0609

Molex Electronics Ltd.
Part No. 43045-0609
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 176.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

    43045-0613

Molex Electronics Ltd.
Part No. 43045-0613
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-424HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

    43045-0611

Molex Electronics Ltd.
Part No. 43045-0611
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 176.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-444HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

    43045-0824

Molex Electronics Ltd.
Part No. 43045-0824
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 92417-466HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs 　 　

Official Product Page

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