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  43045-1817 Datasheet PDF File

For 43045-1817 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-0810

Molex Electronics Ltd.
Part No. 43045-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-0809

Molex Electronics Ltd.
Part No. 43045-0809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-0808

Molex Electronics Ltd.
Part No. 43045-0808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.25K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-418-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0800

Molex Electronics Ltd.
Part No. 43045-0800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 89891-817HLF
Description REC VER THT 34pos
Tech specs 　 　

Official Product Page

    43045-0806

Molex Electronics Ltd.
Part No. 43045-0806
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-818-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0802

Molex Electronics Ltd.
Part No. 43045-0802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-118-17LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 89891-817H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-0820

Molex Electronics Ltd.
Part No. 43045-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits
File Size 174.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 87061-817LF
Description Quickie®, Wire to Board Connector, Double Row, 68 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um Au/GXT Plating
Tech specs 　 　

Official Product Page

    43045-0821

Molex Electronics Ltd.
Part No. 43045-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 183.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-811181750LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 18 Positions
Tech specs 　 　

Official Product Page

    43045-0822

Molex Electronics Ltd.
Part No. 43045-0822
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 183.86K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-518-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

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