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  43045-1807 Datasheet PDF File

For 43045-1807 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Molex
Part No. 43045-XXXX
Description Single and Dual Row Micro-Fit 3.0 Connectors

File Size 81.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-0822

Molex Electronics Ltd.
Part No. 43045-0822
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 183.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-0825

Molex Electronics Ltd.
Part No. 43045-0825
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits

File Size 182.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-807021400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-0821

Molex Electronics Ltd.
Part No. 43045-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 183.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-807051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-0823

Molex Electronics Ltd.
Part No. 43045-0823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row,

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-518-07LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 07 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0820

Molex Electronics Ltd.
Part No. 43045-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits

File Size 174.46K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-807151500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-0810

Molex Electronics Ltd.
Part No. 43045-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits

File Size 180.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-807H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    43045-0809

Molex Electronics Ltd.
Part No. 43045-0809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits

File Size 180.46K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-807HLF
Description REC VER THT 14pos
Tech specs    

Official Product Page

    43045-0808

Molex Electronics Ltd.
Part No. 43045-0808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 184.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 98401-807-54LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-F34-18-076LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 36 Positions.
Tech specs    

Official Product Page

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