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  1140-4129 Datasheet PDF File

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    Pulse Engineering, Inc.
Part No. H1140
Description
File Size 173.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Digital Equipment
Part No. 21140
Description DEC Chip

File Size 1,461.58K  /  43 Page

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Amphenol Communications Solutions

Part No. 75844-129-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

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Part No. 1140-101K
Description 1 ELEMENT, 100 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR

File Size 19.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 68764-129HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 29 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    D1140

Toshiba Semiconductor
Part No. D1140
Description Search --To 2SD1140

File Size 224.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 68024-129HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 76314-129LF
Description Dubox® 2.54mm, Board to Board Connector, 58 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    1140-4028

Molex Electronics Ltd.
Part No. 1140-4028
Description Insulation Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 68004-129HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    1140-4126

Molex Electronics Ltd.
Part No. 1140-4126
Description Barrel Form Punch

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-129-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4018

Molex Electronics Ltd.
Part No. 1140-4018
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-129-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Carlo Gavazzi
TE Connectivity, Ltd.
Part No. P-A3-11400-01 P-A3-11400-02
Description GENERAL PURPOSE INDUCTOR

File Size 124.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 85854-129LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 4 Mod, Press Fit.
Tech specs    

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    W24129A W24129A-15 W24129AJ-15 W24129AJ-12 W24129AK-12 W24129AK-15 W24129A-12

Winbond Electronics, Corp.
Winbond Electronics Corp
Part No. W24129A W24129A-15 W24129AJ-15 W24129AJ-12 W24129AK-12 W24129AK-15 W24129A-12
Description 16K X 8 HIGH-SPEED CMOS STATIC RAM 16K X 8 STANDARD SRAM, 12 ns, PDSO28
16K X 8 HIGH-SPEED CMOS STATIC RAM 16K X 8 STANDARD SRAM, 15 ns, PDIP28
16K X 8 HIGH-SPEED CMOS STATIC RAM 16K X 8 STANDARD SRAM, 15 ns, PDSO28

File Size 199.57K  /  9 Page

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Amphenol Communications Solutions

Part No. 93944-129HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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