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  1140-4010 Datasheet PDF File

For 1140-4010 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    11-40-2043 1140-2043 0011-40-2043

Molex Electronics Ltd.
Part No. 11-40-2043 1140-2043 0011-40-2043
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4016 0011-40-4016

Molex Electronics Ltd.
Part No. 1140-4016 0011-40-4016
Description Conductor Punch

File Size 11.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2045 1140-2045 0011-40-2045

Molex Electronics Ltd.
Part No. 11-40-2045 1140-2045 0011-40-2045
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 19.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2064 1140-2064 0011-40-2064

Molex Electronics Ltd.
Part No. 11-40-2064 1140-2064 0011-40-2064
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-05LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 05 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2042 1140-2042 0011-40-2042

Molex Electronics Ltd.
Part No. 11-40-2042 1140-2042 0011-40-2042
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch

File Size 14.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-07LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 07 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-71395-1140

Molex Electronics Ltd.
Part No. A-71395-1140
Description 2.54mm (.100) Pitch C-Grid垄莽 PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 40 Circuits

File Size 736.43K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-401-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70475-1140

Molex Electronics Ltd.
Part No. A-70475-1140
Description
File Size 139.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-401-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 1140-4010 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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