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  0040.1152 Datasheet PDF File

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    MXP1152

MICROSEMI[Microsemi Corporation]
Part No. MXP1152
Description NPN Photo Transistor Hybrid Optocoupler
File Size 29.29K  /  1 Page

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Amphenol Cables on Demand
Part No. SF-NDYYYF0004-001.5M
Description Amphenol SF-NDYYYF0004-001.5M 1.5m (4.9') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
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HUA FENG CIRCUIT





    IR1152S

International Rectifier
Part No. IR1152S
Description uPFC ONE CYCLE CONTROL PFC IC
File Size 326.55K  /  20 Page

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Amphenol Communications Solutions
Part No. 77311-152-02LF
Description BERGSTIK
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    Integrated Technology F...
Part No. 211152B
Description Typical 1dB Bandwidth of 11.11MHz
File Size 164.12K  /  2 Page

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Amphenol Communications Solutions
Part No. 68691-152HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 52 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    L1152L-XX-AF5-R L1152G-XX-AF5-R

Unisonic Technologies
Part No. L1152L-XX-AF5-R L1152G-XX-AF5-R
Description 500mA, LOW DROPOUT, LOW NOISE ULTRA-FAST WITH SOFT START CMOS LDO REGULATOR
File Size 158.79K  /  5 Page

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Amphenol Communications Solutions
Part No. RJE7B1881152
Description Modular Jack - High Performance, Input Output Connectors 8P8C, CAT 6A, RA, Shield, with LEDs.
Tech specs 　 　

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    ST1152B

Silicon Touch Technology Inc.
Part No. ST1152B
Description Low-saturation, Low-voltage Bi-directional Motor Driver
File Size 195.68K  /  10 Page

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Amphenol Communications Solutions
Part No. 77313-115-24LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
Tech specs 　 　

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    M301152

E-SWITCH
Part No. M301152
Description All Dimension In MM
File Size 58.77K  /  1 Page

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Amphenol Communications Solutions
Part No. 68481-152H
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 52 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    TGA1152-SCC

TriQuint Semiconductor
Part No. TGA1152-SCC
Description 13.75 - 15 GHz 2 Watt Power Amplifier
File Size 545.09K  /  7 Page

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Amphenol Communications Solutions
Part No. 77311-525-04LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Single Row, 4 Positions
Tech specs 　 　

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    TRIQUINT SEMICONDUCTOR INC
Part No. TGA1152-EPU
Description RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
File Size 439.60K  /  8 Page

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Amphenol Communications Solutions
Part No. 87901-152HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 52 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

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    DATA DEVICE CORP
Part No. DSC-11524-274 DSC-11524-823W DSC-11524-433W DSC-11524-393K
Description DIGITAL TO SYNCHRO OR RESOLVER, DIP36
File Size 440.14K  /  13 Page

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Amphenol Communications Solutions
Part No. RJE711881152
Description Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
Tech specs 　 　

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    Microchip
Part No. EMC1152-1-AIZL-TR EMC1152-AIZL-TR
Description Thermal Management Products- Temperature Sensors
File Size 105.88K  /  3 Page

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Amphenol Communications Solutions
Part No. 79821-152HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 52 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs 　 　

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