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Integrated Device Techn...
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| Part No. |
IDT5V41236
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| OCR Text |
...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor... |
| Description |
4 OUTPUT PCIE GEN1/2/3 SYNTHESIZER
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| File Size |
319.35K /
18 Page |
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it Online |
Download Datasheet
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Powerex Power Semicondu...
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| Part No. |
CP20TD1-12A
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| OCR Text |
...ration. **t c is measured just underneath the power chip. ***pulse width and repetition rate should be such that the device junction temperature (t j ) does not exceed t j(max.) rating. ****i e , v ec , t rr , and q rr represent characte... |
| Description |
DIP-CIB 20 Amperes/600 Volts
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| File Size |
270.19K /
6 Page |
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it Online |
Download Datasheet |
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Integrated Device Techn...
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| Part No. |
IDT5V41068A
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| OCR Text |
...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor... |
| Description |
16-pin TSSOP package
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| File Size |
178.97K /
13 Page |
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it Online |
Download Datasheet |
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Integrated Device Techn...
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| Part No. |
IDT5V41067A
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| OCR Text |
...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. external components a minimum number of external components are required for proper operation. decoupling capacitor... |
| Description |
20-pin TSSOP package
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| File Size |
187.52K /
13 Page |
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it Online |
Download Datasheet |
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Price and Availability
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