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  ribbons Datasheet PDF File

For ribbons Found Datasheets File :: 117    Search Time::1.219ms    
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    MACOM[Tyco Electronics]
Part No. MA4P7464F-1072T
OCR Text ...uctance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new nonmagnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN ...
Description Non Magnetic SMQ HIPAX PIN Diode

File Size 135.46K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MA4P7470F-1072T
OCR Text ...uctance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new nonmagnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN ...
Description Non Magnetic SMQ HIPAX PIN Diode

File Size 133.39K  /  6 Page

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    MA-Com
MACOM[Tyco Electronics]
Part No. MASW8000
OCR Text ...an four bond wires or two 3-mil ribbons from ground pads to package are recommended.
Description DC-8 GHz GaAs SPDT switch
GaAs SPDT Switch DC - 8 GHz

File Size 84.44K  /  2 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4600-EPU
OCR Text ...3 mil ribbon 3 mil ribbon ribbons as short as possible GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Note: Devices designated as...
Description 60 GHz Low-Noise Amplifier
60GHz Low Noise Amplifier

File Size 123.48K  /  8 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4905-CP
OCR Text ...s may be gold bondwires or gold ribbons. The RF interconnects should be as short as possible. A minimum of two 1 mil wires are recommended for the RF Input, RF Output, Vg, and Vd1. Six bondwires are recommended for Vd2. ORDERING INFORMAT...
Description 4 Watt Ka Band Packaged Amplifier

File Size 107.88K  /  9 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4915-EPU-CP
OCR Text ...s may be gold bondwires or gold ribbons. The RF interconnects should be as short as possible. A minimum of two 1 mil wires are recommended for the RF Input, RF Output, Vg, and Vd1 and Vd3. Six bondwires are recommended for Vd2 and Vd4. O...
Description Ka-Band 7 W Packaged Amplifier
7 W Ka Band Packaged Power Amplifier

File Size 129.28K  /  8 Page

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    MACOM[Tyco Electronics]
Part No. MA4P7441F-1091T
OCR Text ...uctance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new non- magnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PI...
Description Non Magnetic SMQ HIPAX PIN Diode

File Size 132.75K  /  6 Page

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    HMC-ALH14007

Hittite Microwave Corporation
Part No. HMC-ALH14007
OCR Text ... <10 mil (long) by 3 by 0.5 mil ribbons on input and output.10 Ohms Note 3: Gate bond pads (VG) exist on the upper & lower sides of the MMIC for assembly convenience. For best performance the unused pad should be attached to a 100pF cap to ...
Description GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz

File Size 175.10K  /  6 Page

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    HMC-XDB112

Hittite Microwave Corporation
Part No. HMC-XDB112
OCR Text ... <10 mil (long) by 3 by 0.5 mil ribbons on input and output. 2 - 72 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Orde...
Description GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT

File Size 154.20K  /  6 Page

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    HMC-ALH102

Hittite Microwave Corporation
Part No. HMC-ALH102
OCR Text ... <10 mil (long) by 3 by 0.5 mil ribbons on input and output.10 Ohms Note 3: Gate bond pads (VG) exist on the upper & lower sides of the MMIC for assembly convenience. For best performance the unused pad should be attached to a 100pF cap to ...
Description GaAs HEMT MMIC WIDEBAND LOW NOISE AMPLIFIER, 2 - 20 GHz

File Size 177.32K  /  6 Page

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For ribbons Found Datasheets File :: 117    Search Time::1.219ms    
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