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  perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 885    Search Time::1.39ms    
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    HMC364

美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
Part No. HMC364
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description GaAs HBT MMIC DIVIDE-BY-2, DC - 13.0 GHz

File Size 185.26K  /  6 Page

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    SAA1502ATS

PHILIPS[Philips Semiconductors]
Part No. SAA1502ATS
OCR Text ...t is contained within the solid perimeter is the safety IC SAA1502ATS. It is a Multichip Module (MCM), containing two separate but interconnected chips, one is the control IC and the other contains two vertical power NMOS transistors which ...
Description Safety IC for Li-ion

File Size 100.53K  /  20 Page

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    Sony Corp
Part No. ILX511
OCR Text ...re than 0.7 mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Upper ceramic layer 39N 29N 29N 0.9Nm Lower ceramic layer (1) Low-...
Description LINEAR CCD IMAGE ARRAY,1 VERT PIXELS,2.048K HORIZ PIXELS,DIP
From old datasheet system

File Size 194.74K  /  13 Page

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    HMC346

HITTITE[Hittite Microwave Corporation]
Part No. HMC346
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR DC - 20 GHz
GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR, DC - 20 GHz

File Size 242.04K  /  6 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC347
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description GaAs MMIC SPDT NON-REFLECTIVE SWITCH/ DC - 20.0 GHz
GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 20.0 GHz
GaAs MMIC SPDT NON-REFLECTIVE SWITCH DC - 20.0 GHz

File Size 159.33K  /  6 Page

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    HMC442

美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
Part No. HMC442
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description 800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 25.5 GHz

File Size 229.64K  /  8 Page

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    ILX716K

SONY[Sony Corporation]
Part No. ILX716K
OCR Text ...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm b) In addition, if a load is applied to the entire surface by a hard compone...
Description 3648 X 3pixel CCD Linear Sensor (Color)

File Size 144.10K  /  12 Page

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    ILX718 ILX718K

SONY[Sony Corporation]
Part No. ILX718 ILX718K
OCR Text ...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass , , Plastic portion 39N 29N 29N 0.9Nm Ceram...
Description From old datasheet system
5363-pixel X 3 line CCD Linear Sensor (Color)

File Size 140.61K  /  12 Page

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    Xilinx Inc
Part No. XCS30XL-4VQ100C XCS30XL-4CS280C
OCR Text ... channels), and surrounded by a perimeter of programmable Input/Output Blocks (IOBs), as seen in Figure 1. They have generous routing resources to accommodate the most complex interconnect patterns. The devices are customized by loading con...
Description FPGA,576-CELL,CMOS,TQFP,100PIN,PLASTIC
FPGA - Datasheet Reference
From old datasheet system

File Size 781.87K  /  66 Page

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    Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
Part No. HMC331
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description GaAs MMIC PASSIVE FREQUENCY DOUBLER 12 - 18 GHz INPUT
GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT

File Size 97.77K  /  5 Page

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For perimeter Found Datasheets File :: 885    Search Time::1.39ms    
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