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Sony Corp
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| Part No. |
ILX511
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| OCR Text |
...re than 0.7 mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm
Upper ceramic layer 39N 29N 29N 0.9Nm
Lower ceramic layer
(1)
Low-... |
| Description |
LINEAR CCD IMAGE ARRAY,1 VERT PIXELS,2.048K HORIZ PIXELS,DIP From old datasheet system
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| File Size |
194.74K /
13 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC347
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| OCR Text |
...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi... |
| Description |
GaAs MMIC SPDT NON-REFLECTIVE SWITCH/ DC - 20.0 GHz GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 20.0 GHz GaAs MMIC SPDT NON-REFLECTIVE SWITCH DC - 20.0 GHz
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| File Size |
159.33K /
6 Page |
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it Online |
Download Datasheet
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Xilinx Inc
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| Part No. |
XCS30XL-4VQ100C XCS30XL-4CS280C
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| OCR Text |
... channels), and surrounded by a perimeter of programmable Input/Output Blocks (IOBs), as seen in Figure 1. They have generous routing resources to accommodate the most complex interconnect patterns. The devices are customized by loading con... |
| Description |
FPGA,576-CELL,CMOS,TQFP,100PIN,PLASTIC FPGA - Datasheet Reference From old datasheet system
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| File Size |
781.87K /
66 Page |
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it Online |
Download Datasheet
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Hittite Microwave Corpo... HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC331
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| OCR Text |
...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule.
Wire Bonding
RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni... |
| Description |
GaAs MMIC PASSIVE FREQUENCY DOUBLER 12 - 18 GHz INPUT GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT
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| File Size |
97.77K /
5 Page |
View
it Online |
Download Datasheet
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