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Dynex Semiconductor, Ltd. DYNEX[Dynex Semiconductor]
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| Part No. |
GP1600FSM18
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| OCR Text |
...ing Capability 1600A Per Module Non Punch Through Silicon Isolated MMC Base with AlN Substrates
KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK)
1800V 3.5V 1600A 3200A
APPLICATIONS
External connection
s s s s
High Reli... |
| Description |
Hi-Reliability Single Switch IGBT Module 1600 A, 1800 V, N-CHANNEL IGBT
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| File Size |
126.66K /
9 Page |
View
it Online |
Download Datasheet
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DYNEX[Dynex Semiconductor]
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| Part No. |
GP1600FSS18
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| OCR Text |
...ry 2001
FEATURES
s s s s
Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1600A Per Module
KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK)
1800V 3.5V 1600A 3200A
APPLICATIONS
... |
| Description |
Single Switch IGBT Module
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| File Size |
126.53K /
9 Page |
View
it Online |
Download Datasheet
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Price and Availability
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