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  HM15-21000LF Datasheet PDF File

For HM15-21000LF Found Datasheets File :: 69+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 |   

    HHM1522B1-15

TDK Electronics
Part No. HHM1522B1-15
Description Multilayer Balun
File Size 67.97K  /  6 Page

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Amphenol Communications Solutions
Part No. 92821-000LF
Description Header, Top Mount without Locator, D/D(136Pins), R/A, 5V, 0mm s/o
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    HHM1518A3

TDK Electronics
Part No. HHM1518A3
Description Multilayer Chip Baluns For DCS-PCS/Tx & Rx
File Size 38.71K  /  2 Page

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Amphenol Communications Solutions
Part No. 10138796-21000LF
Description HPCE CTB VT HEADER 4HP with latch
Tech specs 　 　

Official Product Page

    HHM1515B2-15

TDK Electronics
Part No. HHM1515B2-15
Description Multilayer Balun
File Size 67.16K  /  6 Page

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Amphenol Communications Solutions
Part No. 54111-108021000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1520A2 HHM1520-15

TDK Electronics
Part No. HHM1520A2 HHM1520-15
Description Multilayer Balun
File Size 67.66K  /  6 Page

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Amphenol Communications Solutions
Part No. 54121-804321000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1583B1

TDK Electronics
Part No. HHM1583B1
Description Multilayer Chip Baluns For UWB
File Size 42.26K  /  2 Page

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Amphenol Communications Solutions
Part No. 10125691-21000LF
Description HPCE CTB R/A HEADER 8LP ASM
Tech specs 　 　

Official Product Page

    HHM1523B3

TDK Electronics
Part No. HHM1523B3
Description Multilayer Chip Baluns For AGSM/Tx & Rx
File Size 38.68K  /  2 Page

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Amphenol Communications Solutions
Part No. 10137807-21000LF
Description HPCE CTB R/A HEADER 4HP8S
Tech specs 　 　

Official Product Page

   
Part No. HHM1564A4
Description 824 MHz - 894 MHz RF TRANSFORMER ROHS COMPLIANT
File Size 31.80K  /  2 Page

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Amphenol Communications Solutions
Part No. 10127417-21000LF
Description HPCE CTB VT HEADER 16HP
Tech specs 　 　

Official Product Page

    HHM1522A7

TDK Electronics
Part No. HHM1522A7
Description Multilayer Chip Baluns For AGSM/Tx & Rx
   Multilayer Chip Baluns For AGSM/Tx & Rx
File Size 38.53K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-103121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1522A7-15

TDK Electronics
Part No. HHM1522A7-15
Description Multilayer Balun
File Size 67.65K  /  6 Page

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Amphenol Communications Solutions
Part No. 54112-111121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    HHM1591D1

TDK Electronics
Part No. HHM1591D1
Description Multilayer Balun
File Size 67.21K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-106721000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

For HM15-21000LF Found Datasheets File :: 69+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 |   

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