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Amphenol Communications Solutions |
| Part No. |
10114831-11111LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, GOLD FLASH PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114830-11111LF
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| Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114828-11111LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 11 Positions
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| Tech specs |
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Official Product Page
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Molex, Inc.
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| Part No. |
02-09-1111
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| Description |
Crimp Socket Contact; Wire Size (AWG):14-18; Contact Material:Brass; Contact Plating:Tin; Contact Termination:Crimp BRASS, WIRE TERMINAL
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| File Size |
49.01K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10114831-11114LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, GOLD FLASH PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-11115LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, GOLD FLASH PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-11113LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, GOLD FLASH PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-11110LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 10 POSITIONS, GOLD FLASH PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-11112LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, GOLD FLASH PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-11111LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 11 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0114
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.23K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114828-11115LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
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| Tech specs |
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Official Product Page
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Price and Availability
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