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  CTSCH875DF-470L Datasheet PDF File

For CTSCH875DF-470L Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Samsung Electronic
Part No. M470L1624BT0
Description 16Mx64 200pin DDR SDRAM SODIMM based on 16Mx16 Data Sheet

File Size 120.94K  /  14 Page

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Amphenol Communications Solutions

Part No. 77313-124-70LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Samsung Electronic
Part No. M470L3223BT0
Description 32Mx64 200pin DDR SDRAM SODIMM based on 32Mx8 Data Sheet

File Size 126.18K  /  14 Page

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Amphenol Communications Solutions

Part No. 77317-804-70LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 70 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. M470L6423CK0
Description 512MB DDR SDRAM MODULE (64Mx64 based on DDP 64Mx 8 DDR SDRAM) 200pin SODIMM 64bit Non-ECC/Parity

File Size 107.08K  /  14 Page

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Amphenol Communications Solutions

Part No. 77317-404-70LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 70 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    Samsung Electronic
Part No. M470L1713CT0
Description 16Mx64 200pin DDR SDRAM SODIMM based on 16Mx8 Data Sheet

File Size 126.13K  /  14 Page

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Amphenol Communications Solutions

Part No. 54121-129043470LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. M470L6423CK0
Description 64Mx64 200pin DDR SDRAM SODIMM based on DDP 64Mx8 Data Sheet

File Size 160.51K  /  14 Page

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Amphenol Communications Solutions

Part No. 77317-104-70LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 70 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    CTSCH875DF-330L CTSCH875DF-182K CTSCH875DF-103K CTSCH875DF-821K CTSCH875DF-471K CTSCH875DF-472K CTSCH875DF-560L CTSCH875

Central Technologies
Part No. CTSCH875DF-330L CTSCH875DF-182K CTSCH875DF-103K CTSCH875DF-821K CTSCH875DF-471K CTSCH875DF-472K CTSCH875DF-560L CTSCH875DF-680L CTSCH875DF-101L CTSCH875DF-100L CTSCH875DF-122K CTSCH875DF-181K CTSCH875DF-470L CTSCH875DF CTSCH875DF-102K CTSCH875DF-121K CTSCH875DF-151K CTSCH875DF-152K CTSCH875DF-220L CTSCH875DF-221K CTSCH875DF-222K CTSCH875DF-270L CTSCH875DF-271K CTSCH875DF-272K CTSCH875DF-331K CTSCH875DF-332K CTSCH875DF-390L CTSCH875DF-391K CTSCH875DF-392K CTSCH875DF-562K CTSCH875DF-561K CTSCH875DF-822K CTSCH875DF-681K CTSCH875DF-820L CTSCH875DF-682K CENTRALTECHNOLOGIES-CTSCH875DF-560L
Description Shielded Peaking Coils - Radial

File Size 453.88K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-824-70LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. M470L1624FU0-CA2 M470L1624FU0-CB3
Description DDR SDRAM SODIMM

File Size 265.91K  /  20 Page

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Amphenol Communications Solutions

Part No. 77313-424-70LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions
Tech specs    

Official Product Page

   
Part No. M470L1624DT0-CLA0
Description 16M X 64 DDR DRAM MODULE, 0.8 ns, DMA200

File Size 145.85K  /  12 Page

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Amphenol Communications Solutions

Part No. 51940-470LF
Description PwrBlade®, Power Supply Connectors, 3ACP 24S Vertical Receptacle.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. M470L6423EN0-CLB3 M470L6423EN M470L6423EN0-A2 M470L6423EN0-B0 M470L6423EN0-CB3
Description 512MB Unbuffered SODIMM(based on sTSOP)

File Size 143.58K  /  13 Page

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Amphenol Communications Solutions

Part No. 65863-470LF
Description Quickie Header, Wire to Board Connector, Double Row, 24 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    HIROSE ELECTRIC Co., Ltd.
Part No. DM10470LJ/A
Description x1 SRAM x1的SRAM

File Size 158.80K  /  5 Page

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Amphenol Communications Solutions

Part No. 51939-470LF
Description PwrBlade®, Power Connectors, 100S Right Angle Header, Solder to Board
Tech specs    

Official Product Page

For CTSCH875DF-470L Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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