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  BY228-1310 Datasheet PDF File

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    BY228GP

Vishay Siliconix
Part No. BY228GP
Description Clamper/Damper Glass Passivated Rectifier
File Size 132.50K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-103-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
Tech specs 　 　

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HUA FENG CIRCUIT





    BY228 BY22810

Vishay Siliconix
Part No. BY228 BY22810
Description Standard Avalanche Sinterglass Diode
File Size 98.09K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-102-56LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 56 Positions
Tech specs 　 　

Official Product Page

    D-BY228G11

Diotec Semiconductor
Part No. D-BY228G11
Description Fast Switching Si-Rectifiers
File Size 90.18K  /  2 Page

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Amphenol Communications Solutions
Part No. 10106268-0013101LF
Description PwrBlade+® , Power Connectors, 52S STB, Vertical, Receptacle.
Tech specs 　 　

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    BY228TAP

Vishay Siliconix
Part No. BY228TAP
Description Standard Avalanche Sinterglass Diode
File Size 107.09K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-103-06LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Double Row, 6 Positions
Tech specs 　 　

Official Product Page

    BY226G BY227G BY228G

Semikron International
Part No. BY226G BY227G BY228G
Description Standard silicon rectifier diodes 3 A, 450 V, SILICON, RECTIFIER DIODE, DO-201
Wirewound Inductor; Inductor Type:High Frequency; Inductance:3.9nH; Inductance Tolerance: /- 0.3 nH; Current Rating:450mA; Series:IMC; Package/Case:0603; Core Material:Ceramic; Leaded Process Compatible:Yes RoHS Compliant: Yes
File Size 137.93K  /  2 Page

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Amphenol Communications Solutions
Part No. 77313-102-24LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
Tech specs 　 　

Official Product Page

    BY226S BY227S BY228S

Semikron International
Part No. BY226S BY227S BY228S
Description STANDARD SILICON RECTIFIER DIODES
File Size 136.61K  /  2 Page

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Amphenol Communications Solutions
Part No. 77313-101-72LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions
Tech specs 　 　

Official Product Page

   
Part No. FP-1310-4I-LC
Description FIBER OPTIC LASER DIODE EMITTER, 1290-1330nm, 4000Mbps, THROUGH HOLE MOUNT, TO-56, LC CONNECTOR
File Size 469.04K  /  9 Page

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Amphenol Communications Solutions
Part No. 77313-102-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 42 Positions
Tech specs 　 　

Official Product Page

    MITEQ INC
Part No. AU-1310-F AU-1310-N
Description 0.01 MHz - 500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
File Size 319.30K  /  7 Page

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Amphenol Communications Solutions
Part No. 77313-102-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 36 Positions
Tech specs 　 　

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    1310-2A-24.5 1310-2C-24.5 1310-2B-24.5

Tyco Electronics
Part No. 1310-2A-24.5 1310-2C-24.5 1310-2B-24.5
Description 1310 Series DC Voltage Level Sensor, Relay Output
File Size 301.55K  /  1 Page

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Amphenol Communications Solutions
Part No. 10061913-103TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    WST-1310

Soberton Inc.
Part No. WST-1310
Description Washable Reflow Type (SMD)
File Size 103.07K  /  2 Page

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Amphenol Communications Solutions
Part No. 68021-310HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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