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  90136-1114 Datasheet PDF File

For 90136-1114 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2118

Molex Electronics Ltd.
Part No. 90136-2118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2310

Molex Electronics Ltd.
Part No. 90136-2310
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2132

Molex Electronics Ltd.
Part No. 90136-2132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2125

Molex Electronics Ltd.
Part No. 90136-2125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 68031-114HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    90136-2230

Molex Electronics Ltd.
Part No. 90136-2230
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 68771-114HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2115

Molex Electronics Ltd.
Part No. 90136-2115
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 162.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 89361-114LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs    

Official Product Page

    90136-2112

Molex Electronics Ltd.
Part No. 90136-2112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. U77A11141001
Description 1X1 SFP CAGE 1.8 S/P
Tech specs    

Official Product Page

    90136-2107

Molex Electronics Ltd.
Part No. 90136-2107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-111140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    90136-1325

Molex Electronics Ltd.
Part No. 90136-1325
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-411142400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    90136-1210

Molex Electronics Ltd.
Part No. 90136-1210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68481-114HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 90136-1114 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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