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  90136-1110 Datasheet PDF File

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    90136-2118

Molex Electronics Ltd.
Part No. 90136-2118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs 　 　

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HUA FENG CIRCUIT





    90136-1212

Molex Electronics Ltd.
Part No. 90136-1212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    90136-1210

Molex Electronics Ltd.
Part No. 90136-1210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    90136-2218

Molex Electronics Ltd.
Part No. 90136-2218
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 10130611-101LF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 4-Pair, 8 column, 112 position, Right Angle Receptacle, No Guide Pin.
Tech specs 　 　

Official Product Page

    90136-1325

Molex Electronics Ltd.
Part No. 90136-1325
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 159.22K  /  4 Page

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Amphenol Communications Solutions
Part No. 77311-102T12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    90136-2212

Molex Electronics Ltd.
Part No. 90136-2212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 10131318-2211100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    90136-1205

Molex Electronics Ltd.
Part No. 90136-1205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131318-0811100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    90136-1202

Molex Electronics Ltd.
Part No. 90136-1202
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-1411100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    90136-1206

Molex Electronics Ltd.
Part No. 90136-1206
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. G832MB111003222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 100ΩPositions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs 　 　

Official Product Page

    90136-2225

Molex Electronics Ltd.
Part No. 90136-2225
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 25 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 254.33K  /  5 Page

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Amphenol Communications Solutions
Part No. 63411-102LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

Official Product Page

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