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  8797 Datasheet PDF File

For 8797 Found Datasheets File :: 46+       Page :: | 1 | 2 | <3> | 4 | 5 |   

    Matsshita / Panasonic
Part No. DN8797SE 0538
Description Hall ICs
From old datasheet system

File Size 70.09K  /  5 Page

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Rochester Electronics LLC

Part No. MG8797BH/B
Description 8797BH - 16 Bit CPU w/A/D
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Intel
Part No. N8797BH N8097BH 8097BH
Description Advanced 16-Bit Microcontroller

File Size 880.29K  /  22 Page

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Amphenol Communications Solutions

Part No. 68797-424HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

   
Part No. ICS87973I
Description From old datasheet system

File Size 132.11K  /  16 Page

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Amphenol Communications Solutions

Part No. 68797-124HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

   
Part No. ICS87972I
Description From old datasheet system

File Size 154.32K  /  15 Page

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Amphenol Communications Solutions

Part No. 68797-434HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    Integrated Device Techn...
Part No. ICS87972I-147
Description Fully integrated PLL

File Size 638.10K  /  17 Page

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Amphenol Communications Solutions

Part No. 68797-419HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    Integrated Device Techn...
Part No. 87973DYI-147LF 87973I-147
Description Low Skew, 1-to-12 LVCMOS/ LVTTL Clock Multiplier/ Zero Delay Buffer

File Size 463.07K  /  20 Page

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Amphenol Communications Solutions

Part No. 68797-427HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    G8343-11 G8343-12 G8343-21 G8343-22 G8343-31 G8343-32 G8211-21 G8797-32 G8211-11 G8211-12 G8211-22 G8211-31 G8211-32 G83

HAMAMATSU[Hamamatsu Corporation]
NXP Semiconductors N.V.
Hamamatsu Photonics K.K.
Part No. G8343-11 G8343-12 G8343-21 G8343-22 G8343-31 G8343-32 G8211-21 G8797-32 G8211-11 G8211-12 G8211-22 G8211-31 G8211-32 G8340 G8340-11 G8340-12 G8340-21 G8340-22 G8340-31 G8340-32 G8797-11 G8797-12 G8797-21 G8797-22 G8797-31 G8797-31SC G8343-32FC G8211-11SC G8211-21SC G8340-11SC G8340-21SC
Description    InGaAs PIN photodiode with preamp
Aluminum Snap-In Capacitor; Capacitance: 1500uF; Voltage: 160V; Case Size: 25x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 35x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 180uF; Voltage: 400V; Case Size: 30x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 150uF; Voltage: 450V; Case Size: 25x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 200V; Case Size: 22x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 330uF; Voltage: 400V; Case Size: 25x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 1000uF; Voltage: 200V; Case Size: 25x50 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 25x40 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 30x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 22x50 mm; Packaging: Bulk
Optoelectronic 光电
InGaAs PIN photodiode with preamp 铟镓砷PIN光电二极管和前置放大

File Size 99.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 68797-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    Integrated Device Techn...
Part No. 87972DYI-147LFT 87972I-147
Description Low Skew, 1-to-12 LVCMOS/LVTTL Clock Multiplier/Zero Delay Buffer

File Size 209.32K  /  18 Page

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Amphenol Communications Solutions

Part No. 68797-107HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 7 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    0879700001 87970-0001

Molex Electronics Ltd.
Part No. 0879700001 87970-0001
Description 1.27mm (.050) Signal Pitch, 0.80mm (.031) SCSI Pitch, 1.27mm (.050) Power Pitch SAS Receptacle, Vertical, Through Hole, with Straight Solder Tab
MOLEX Connector

File Size 275.62K  /  6 Page

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Amphenol Communications Solutions

Part No. 68797-108HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    87977-9001 0879779001

http://
Molex Electronics Ltd.
Part No. 87977-9001 0879779001
Description 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Press-Fit, 240 Circuits, 1.8V Center Voltage Key, with Plastic Locating Peg and Press-Fit Metal Pins

File Size 398.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 68797-125HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

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