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  87914-2815 Datasheet PDF File

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    0879144416 87914-4416

Molex Electronics Ltd.
Part No. 0879144416 87914-4416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-4201 0879144201

Molex Electronics Ltd.
Part No. 87914-4201 0879144201
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 759.73K  /  11 Page

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Amphenol Communications Solutions

Part No. 54242-107281500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-3816 0879143816

Molex Electronics Ltd.
Part No. 87914-3816 0879143816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 59202-T28-15A062LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    0879140816

Molex Electronics Ltd.
Part No. 0879140816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. RJMG1S1128151ER
Description RJMG, Input output Connectors, 2x2 10/100 with leds
Tech specs    

Official Product Page

    0879140009

Molex Electronics Ltd.
Part No. 0879140009
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free

File Size 3,779.28K  /  48 Page

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Amphenol Communications Solutions

Part No. 77315-428-15LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0879143203 87914-3203

Molex Electronics Ltd.
Part No. 0879143203 87914-3203
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free

File Size 759.86K  /  11 Page

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Amphenol Communications Solutions

Part No. 59202-G28-15-060LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    87914-8016 0879148016

Molex Electronics Ltd.
Part No. 87914-8016 0879148016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 80 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 59202-H28-15A060LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    0879144204

Molex Electronics Ltd.
Part No. 0879144204
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 4,416.61K  /  57 Page

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Texas Instruments

Part No. TPS2815P
Description Two input NAND, Dual High-Speed MOSFET Drivers 8-PDIP
Tech specs    

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Official Product Page

    0879142416 87914-2416

Molex Electronics Ltd.
Part No. 0879142416 87914-2416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Texas Instruments

Part No. TPS2815D
Description Two input NAND, Dual High-Speed MOSFET Drivers 8-SOIC
Tech specs    

Get Free Sample

Official Product Page

    87914-2616 0879142616

Molex Electronics Ltd.
Part No. 87914-2616 0879142616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Texas Instruments

Part No. TPS2815DR
Description Two input NAND, Dual High-Speed MOSFET Drivers 8-SOIC -40 to 125
Tech specs    

Official Product Page

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