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Amphenol Communications Solutions |
| Part No. |
10160299-1111001LF
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| Description |
BergStak® Secure Connector, Vertical Receptacle, 3x37positions, Left Guide
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10161488-001C-TRLF
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| Description |
Floating Board-to-Board Connector, 0.4mm Pitch Header, 80 positions, Mated height equals 4.0mm
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143216 87914-3216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10162416-002RHLF
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| Description |
DDR5 SODIMM, Storage and Server Connector, Right Angle, Surface Mount, 262 Position, 0.5mm Pitch, 4mm Height, Standard, 10u\\ Goldplating
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10162581-3134109LF
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| Description |
Conan® Lite 1.00mm, Board to Board connector, Receptacle, 9 position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10162582-1134111LF
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| Description |
Conan® Lite 1.00mm, Board to Board connector, Header, 11 position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10162583-411141LF
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| Description |
Conan® Lite 1.00mm, Board to Board connector, Right Angle Header, 41 position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143016 87914-3016
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10161952-1210LF
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| Description |
Minitek®Pwr CEM-5 PCIe Receptacle Terminal (Signal), Tin Plating (Post plated), AWG(#28).
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10162688-207206CLF
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| Description |
ComboLock®, 1.00mm (0.039in) Signal and 3.00mm (0.118in) Power Crimp-to-Wire Connector Platform, Wire to Board Header, 6P+7S Position., Top Latch, Gold (preplated)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10164492-M0030GLF
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| Description |
Crimped lead of Dubox® 2.54mm pitch with Gold plated terminals. Standard cable of 300mm length in receptacle-to-receptacle configurations. Wire size AWG 24.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10162416-001RHLF
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| Description |
DDR5 SODIMM, Storage and Server Connector, Right Angle, Surface Mount, 262 Position, 0.5mm Pitch, 4mm Height, Standard, G/F plating
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| Tech specs |
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Official Product Page
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