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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TC4013BP
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| Description |
CMOS Logic IC, D-Type Flip-Flop, DIP14
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
ME1014013401311
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| Description |
Mini Cool Edge 0.60mm,Storage and Server connector ,Gen Z,EDSFF,OCP 3.0,140 signal pins, SMT, OCP, Straddle mount, 1.93mmPCB,-0.3mm offset
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87834-3011
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 30 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
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| File Size |
127.51K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77315-401-35LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions 2.54 mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77317-401-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 36 Positions ,2.54mm (0.100in) Pitch,
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-401-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832MC030401322HR
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| Description |
0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 3.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10044013-10110TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, 280 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-401-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 36 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87834-5095
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05渭m (2渭) Gold (Au) Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating
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| File Size |
115.25K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10118940-134LF
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| Description |
Active Latch Housing Type II, Double Row, 34 Position
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87834-5021
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13渭m (5渭) Gold (Au) Flash Plating, Nylon Housin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing
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| File Size |
124.27K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-401-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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