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  87832-6922 Datasheet PDF File

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    87832-3222

Molex Electronics Ltd.
Part No. 87832-3222
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 32 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap,

File Size 367.55K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-205
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-5423

Molex Electronics Ltd.
Part No. 87832-5423
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 10 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap, with Locking

File Size 386.58K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-214HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-1821

Molex Electronics Ltd.
Part No. 87832-1821
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Lead free, 18 Circuits, 0.76μm (30μ) Gold (Au) Plating

File Size 386.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 65692-232LF
Description Quickie® Slimline Header, Wire To Board, Through Hole, Vertical, Double Row, 30 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87832-1820

Molex Electronics Ltd.
Part No. 87832-1820
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 18 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-230HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-1614

Molex Electronics Ltd.
Part No. 87832-1614
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.80K  /  5 Page

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Amphenol Communications Solutions

Part No. 68692-206H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-1616

Molex Electronics Ltd.
Part No. 87832-1616
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.79K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131936-922ULF
Description Minitek® 2.00mm, Board to Board, PCB Mounted Receptacle, Vertical, Through Hole, Double Row, 22 Positions , 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    87832-7122

Molex Electronics Ltd.
Part No. 87832-7122
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 367.67K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-212HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-7123

Molex Electronics Ltd.
Part No. 87832-7123
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 386.42K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-208HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-1620

Molex Electronics Ltd.
Part No. 87832-1620
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-210HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-4221

Molex Electronics Ltd.
Part No. 87832-4221
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 42 Circuits, 0.76μm (30μ) Gold (Au) Plating

File Size 386.26K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-226HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87832-6922 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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