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  87759-2250 Datasheet PDF File

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    87759-1665

Molex Electronics Ltd.
Part No. 87759-1665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.27K  /  6 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

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HUA FENG CIRCUIT





    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 420.97K  /  8 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
File Size 174.11K  /  4 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

    87759-4075

Molex Electronics Ltd.
Part No. 87759-4075
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 279.39K  /  6 Page

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Amphenol Communications Solutions
Part No. 54242-411322250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-3275

Molex Electronics Ltd.
Part No. 87759-3275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.29K  /  6 Page

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Amphenol Communications Solutions
Part No. 54121-112222500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-4064

Molex Electronics Ltd.
Part No. 87759-4064
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 420.98K  /  8 Page

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Amphenol Communications Solutions
Part No. 54122-112122500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    87759-4466

Molex Electronics Ltd.
Part No. 87759-4466
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 298.85K  /  6 Page

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Amphenol Communications Solutions
Part No. 10128483-122500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 2-pair, 25 column, 22.5mm Plug Height.
Tech specs 　 　

Official Product Page

    87759-3874

Molex Electronics Ltd.
Part No. 87759-3874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
File Size 421.12K  /  8 Page

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Amphenol Communications Solutions
Part No. 10127225-122502ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 19 Column, 152 Position, 22.50mm Stack Height, 2.00mm (0.079in) Column Pitch
Tech specs 　 　

Official Product Page

    87759-1414

Molex Electronics Ltd.
Part No. 87759-1414
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.27K  /  8 Page

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Amphenol Communications Solutions
Part No. 348-5225-065
Description GbX ,Backplane connectors,3 pair U, 25 position, right, 5.55mm, Header
Tech specs 　 　

Official Product Page

    87759-4065

Molex Electronics Ltd.
Part No. 87759-4065
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.27K  /  6 Page

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Amphenol Communications Solutions
Part No. 54112-110082250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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