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  87759-1650 Datasheet PDF File

For 87759-1650 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-4074

Molex Electronics Ltd.
Part No. 87759-4074
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 420.21K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-109051650LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-1465

Molex Electronics Ltd.
Part No. 87759-1465
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,

File Size 280.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-419041650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1464

Molex Electronics Ltd.
Part No. 87759-1464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 421.26K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-109721650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-809201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-4075

Molex Electronics Ltd.
Part No. 87759-4075
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-808361650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3275

Molex Electronics Ltd.
Part No. 87759-3275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-108031650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4064

Molex Electronics Ltd.
Part No. 87759-4064
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-109261650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-2474

Molex Electronics Ltd.
Part No. 87759-2474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 87471-650TRLF
Description Rib-Cage® Board-To-Board, PCB Mounted Receptacle, Vertical, Surface Mount, Polarized, 100 Positions, 1.27mm (0.05in) Pitch.
Tech specs    

Official Product Page

    87759-7634

Molex Electronics Ltd.
Part No. 87759-7634
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs

File Size 355.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 54242-809341650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-7633

Molex Electronics Ltd.
Part No. 87759-7633
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.89K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-109121650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87759-1650 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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