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  87568-1063 Datasheet PDF File

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Part No. 1063
Description MOTORSIRENE 12VDC KONT TON 750HZ

File Size 162.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-106361050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    39-00-0039 39-28-1063

MolexKits
Part No. 39-00-0039 39-28-1063
Description Vertical Header and Receptacle, 6 Circuit

File Size 30.11K  /  2 Page

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Amphenol Communications Solutions

Part No. 54111-106361500LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 22-01-1063 22-01-1123
Description Connector Housing; Gender:Female; Number of Contacts:6; Series:5051-NM; Body Material:PA Polyamide (Nylon) 6/6; Number of Rows:1; Pitch Spacing:2.5mm 6 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
CRIMP HOUSING, 2.5MM 12WAY ; Ways, No. of:12; Colour:White; Current rating:2.5A; Dielectric strength:1500V/m; Flammability rating:UL94V-0; Force, de-mating:0.5N; Force, mating:2N; Housing type:White Nylon UL94V-0; Material:Nylon;

File Size 64.52K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-106361000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HGLM-1063

Agilent (Hewlett-Packard)
Agilent(Hewlett-Packard)
Part No. HGLM-1063
Description Fibre Channel GBaud Optical Link Module

File Size 185.53K  /  10 Page

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Amphenol Communications Solutions

Part No. 54121-106361250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    STMicroelectronics N.V.
Part No. HGLM-1063
Description Fibre Channel GBaud Optical Link Module 光纤通道GBaud光链路模

File Size 196.04K  /  10 Page

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Amphenol Communications Solutions

Part No. 10127721-063LF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 3.2mm Kink Tail (15u\\ Gold) plating, Non GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

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    B1063

Panasonic Semiconductor
Part No. B1063
Description Search --To 2SB1063

File Size 100.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-106301250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    POLYFET[Polyfet RF Devices]
Part No. F1063
Description PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR

File Size 31.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-106320950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    INA-31063 INA-31063-TR1

Agilent(Hewlett-Packard)
AGILENT TECHNOLOGIES INC
Part No. INA-31063 INA-31063-TR1
Description DC-2.5 GHz 3 V, High Isolation Silicon RFIC Amplifier(直流.5 GHz 3 V,高隔离硅射频集成电路放大
3V Fixed Gain. High Isolation amplifier
的DC - 2.5 GHz3伏,高隔离硅射频放大器(直流.5 GHz3伏,高隔离硅射频集成电路放大器)
0 MHz - 2500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER

File Size 80.23K  /  11 Page

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Amphenol Communications Solutions

Part No. 54112-106300800LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. INA-31063-TR1
Description
File Size 72.77K  /  11 Page

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Amphenol Communications Solutions

Part No. 65801-063LF
Description Clincher™ Flex Connectors, Receptacle Assembly, Single Row, 2 Positions, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    23
22
20
MICROPAC[Micropac Industries]
Micropac Industries, Inc.
Part No. 61063-101 61063 61063-001
Description PHOTODIODE “PILL PACK?/a>
PHOTODIODE PILL PACK Micropac Industries
PHOTODIODE “PILL PACK”
PHOTODIODE B>PILL PACK
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight PHOTO DIODE
PHOTODIODE PILL PACK 光电二极管“丸包装

File Size 75.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 50294-1063ELF
Description High Pin Count back plane connectors, Receptacle, Right Angle, 3 Row 0 Guides, Solder tail, 63 Positions
Tech specs    

Official Product Page

For 87568-1063 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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