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  87280-1300 Datasheet PDF File

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    TM-1300

Philips Semiconductors
Part No. TM-1300
Description Media Processor(媒体处理

File Size 2,787.77K  /  533 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TM-1300

NXP Semiconductors
Part No. TM-1300
Description Programmable Media Processor

File Size 2,797.21K  /  533 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs    

Official Product Page

    EPC-1300-0.5-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-2
Description Photodiode-Chip

File Size 122.90K  /  2 Page

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Texas Instruments

Part No. 5962-8872801RA
Description Octal D-type Edge Triggered Flip-Flops with 3-state Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    ELC-1300-17

EPIGAP optoelectronic GmbH
Part No. ELC-1300-17
Description LED - Chip

File Size 84.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-801300800LF
Description BERGSTIK STACKING
Tech specs    

Official Product Page

    Roithner LaserTechnik G...
Part No. EPD-1300-5-0.3
Description    Selective Photodiode

File Size 624.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 92813-007LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    EPC-1300-0.5-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-1
Description Photodiode-Chip

File Size 121.73K  /  2 Page

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Amphenol Communications Solutions

Part No. 92813-005LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    EPC-1300-0.22-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-4
Description Photodiode-Chip

File Size 121.80K  /  2 Page

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Amphenol Communications Solutions

Part No. 10061913-003CLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    EPC-1300-0.22-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-3
Description Photodiode-Chip

File Size 121.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-112021300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EPC-1300-0.22-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-2
Description Photodiode-Chip

File Size 122.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-407031300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EPC-1300-0.22-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-1
Description Photodiode-Chip

File Size 121.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 75188-130-03LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 3 Positions, 5.08mm (0.200in) Pitch.
Tech specs    

Official Product Page

For 87280-1300 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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